Intel Core 2 Duo L7500 vs Intel Pentium 987

Comparative analysis of Intel Core 2 Duo L7500 and Intel Pentium 987 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core 2 Duo L7500

  • Around 6% better performance in PassMark - Single thread mark: 664 vs 625
Benchmarks
PassMark - Single thread mark 664 vs 625

Reasons to consider the Intel Pentium 987

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
  • Around 10% better performance in Geekbench 4 - Single Core: 251 vs 228
  • Around 16% better performance in Geekbench 4 - Multi-Core: 445 vs 383
Specifications (specs)
Manufacturing process technology 32 nm vs 65 nm
Benchmarks
Geekbench 4 - Single Core 251 vs 228
Geekbench 4 - Multi-Core 445 vs 383

Compare benchmarks

CPU 1: Intel Core 2 Duo L7500
CPU 2: Intel Pentium 987

PassMark - Single thread mark
CPU 1
CPU 2
664
625
PassMark - CPU mark
CPU 1
CPU 2
657
657
Geekbench 4 - Single Core
CPU 1
CPU 2
228
251
Geekbench 4 - Multi-Core
CPU 1
CPU 2
383
445
Name Intel Core 2 Duo L7500 Intel Pentium 987
PassMark - Single thread mark 664 625
PassMark - CPU mark 657 657
Geekbench 4 - Single Core 228 251
Geekbench 4 - Multi-Core 383 445

Compare specifications (specs)

Intel Core 2 Duo L7500 Intel Pentium 987

Essentials

Architecture codename Merom Sandy Bridge
Launch date Q3'06 1 June 2012
Place in performance rating 3053 3055
Processor Number L7500 987
Series Legacy Intel® Core™ Processors Legacy Intel® Pentium® Processor
Status Discontinued Launched
Vertical segment Mobile Mobile
Launch price (MSRP) $134

Performance

64 bit support
Base frequency 1.60 GHz 1.50 GHz
Bus Speed 800 MHz FSB 5 DMI
Die size 143 mm2 131 mm
Manufacturing process technology 65 nm 32 nm
Maximum core temperature 100°C 100 °C
Number of cores 2 2
Transistor count 291 million 504 million
VID voltage range 0.975V - 1.062V
L1 cache 128 KB
L2 cache 512 KB
L3 cache 2048 KB
Maximum frequency 1.5 GHz
Number of threads 2

Compatibility

Low Halogen Options Available
Package Size 35mm x 35mm 31.0mm x 24.0mm (BGA1023)
Sockets supported PBGA479 FCBGA1023
Thermal Design Power (TDP) 17 Watt 17 Watt
Max number of CPUs in a configuration 1

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Anti-Theft technology

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
4G WiMAX Wireless
Flexible Display interface (FDI)
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® My WiFi technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

Memory

Max memory channels 2
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 16.38 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.00 GHz
Graphics max frequency 1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO
Wireless Display (WiDi) support

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4

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