Intel Core 2 Duo L7700 vs Intel Pentium 967

Comparative analysis of Intel Core 2 Duo L7700 and Intel Pentium 967 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo L7700

Intel Pentium 967

Differences

Reasons to consider the Intel Core 2 Duo L7700

Around 13% better performance in PassMark - Single thread mark: 699 vs 616
Around 5% better performance in PassMark - CPU mark: 677 vs 643

Benchmarks
PassMark - Single thread mark	699 vs 616
PassMark - CPU mark	677 vs 643

Reasons to consider the Intel Pentium 967

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 9% better performance in Geekbench 4 - Single Core: 1227 vs 1130
Around 4% better performance in Geekbench 4 - Multi-Core: 1904 vs 1832

Specifications (specs)
Manufacturing process technology	32 nm vs 65 nm
Benchmarks
Geekbench 4 - Single Core	1227 vs 1130
Geekbench 4 - Multi-Core	1904 vs 1832

Compare benchmarks

CPU 1: Intel Core 2 Duo L7700
CPU 2: Intel Pentium 967

PassMark - Single thread mark

CPU 1

CPU 2

699

616

PassMark - CPU mark

CPU 1

CPU 2

677

643

Geekbench 4 - Single Core

CPU 1

CPU 2

1130

1227

Geekbench 4 - Multi-Core

CPU 1

CPU 2

1832

1904

Name	Intel Core 2 Duo L7700	Intel Pentium 967
PassMark - Single thread mark	699	616
PassMark - CPU mark	677	643
Geekbench 4 - Single Core	1130	1227
Geekbench 4 - Multi-Core	1832	1904

Compare specifications (specs)

	Intel Core 2 Duo L7700	Intel Pentium 967
Essentials
Architecture codename	Merom	Sandy Bridge
Launch date	Q3'07	1 October 2011
Place in performance rating	2324	2332
Processor Number	L7700	967
Series	Legacy Intel® Core™ Processors	Legacy Intel® Pentium® Processor
Status	Discontinued	Launched
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	1.80 GHz	1.30 GHz
Bus Speed	800 MHz FSB	5 GT/s DMI
Die size	143 mm2	131 mm
Manufacturing process technology	65 nm	32 nm
Maximum core temperature	100°C	100 °C
Number of cores	2	2
Transistor count	291 million	504 million
VID voltage range	0.90V-1.20V
L1 cache		128 KB
L2 cache		512 KB
L3 cache		2 MB
Maximum frequency		1.3 GHz
Number of threads		2
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	31.0mm x 24.0mm (BGA1023)
Thermal Design Power (TDP)	17 Watt	17 Watt
Max number of CPUs in a configuration		1
Sockets supported		BGA1023
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Anti-Theft technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
4G WiMAX Wireless
Flexible Display interface (FDI)
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® My WiFi technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Memory
Max memory channels		2
Maximum memory bandwidth		21.3 GB/s
Maximum memory size		16 GB
Supported memory types		DDR3 1066/1333
Graphics
Graphics base frequency		350 MHz
Graphics max dynamic frequency		1.00 GHz
Graphics max frequency		1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported		2
SDVO
Wireless Display (WiDi) support
Peripherals
Max number of PCIe lanes		16
PCI Express revision		2.0
PCIe configurations		1x16, 2x8, 1x8 2x4