Intel Core 2 Duo T7400 vs Intel Core Duo T2300

Comparative analysis of Intel Core 2 Duo T7400 and Intel Core Duo T2300 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo T7400

Intel Core Duo T2300

Differences

Reasons to consider the Intel Core 2 Duo T7400

CPU is newer: launch date 7 month(s) later
Around 30% higher clock speed: 2.16 GHz vs 1.66 GHz
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 50% better performance in PassMark - Single thread mark: 761 vs 509
2.3x better performance in PassMark - CPU mark: 754 vs 325

Specifications (specs)
Launch date	28 August 2006 vs January 2006
Maximum frequency	2.16 GHz vs 1.66 GHz
L2 cache	4096 KB vs 2048 KB
Benchmarks
PassMark - Single thread mark	761 vs 509
PassMark - CPU mark	754 vs 325

Reasons to consider the Intel Core Duo T2300

Around 10% lower typical power consumption: 31 Watt vs 34 Watt

Thermal Design Power (TDP)	31 Watt vs 34 Watt

Compare benchmarks

CPU 1: Intel Core 2 Duo T7400
CPU 2: Intel Core Duo T2300

PassMark - Single thread mark

CPU 1

CPU 2

761

509

PassMark - CPU mark

CPU 1

CPU 2

754

325

Name	Intel Core 2 Duo T7400	Intel Core Duo T2300
PassMark - Single thread mark	761	509
PassMark - CPU mark	754	325
Geekbench 4 - Single Core	273
Geekbench 4 - Multi-Core	481

Compare specifications (specs)

	Intel Core 2 Duo T7400	Intel Core Duo T2300
Essentials
Architecture codename	Merom	Yonah
Launch date	28 August 2006	January 2006
Launch price (MSRP)	$286
Place in performance rating	2948	3005
Processor Number	T7400	T2300
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	2.16 GHz	1.66 GHz
Bus Speed	667 MHz FSB	667 MHz FSB
Die size	143 mm2	90 mm2
Front-side bus (FSB)	667 MHz	667 MHz
L1 cache	64 KB
L2 cache	4096 KB	2048 KB
Manufacturing process technology	65 nm	65 nm
Maximum core temperature	100°C	100°C
Maximum frequency	2.16 GHz	1.66 GHz
Number of cores	2	2
Number of threads	2	2
Transistor count	291 million	151 million
VID voltage range	1.1625V-1.300V	1.1625V - 1.30V
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	35mm x 35mm	35mm x 35mm
Scenario Design Power (SDP)	0 W	0 W
Sockets supported	PPGA478, PBGA479	PPGA478, PBGA479
Thermal Design Power (TDP)	34 Watt	31 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)
Memory
Supported memory types		DDR1