Intel Core 2 Solo ULV U2100 vs Intel Core 2 Duo T7250
Comparative analysis of Intel Core 2 Solo ULV U2100 and Intel Core 2 Duo T7250 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Solo ULV U2100
- CPU is newer: launch date 0 month(s) later
- 5.8x lower typical power consumption: 5.5 Watt vs 35 Watt
Launch date | September 2007 vs 2 August 2007 |
Thermal Design Power (TDP) | 5.5 Watt vs 35 Watt |
Reasons to consider the Intel Core 2 Duo T7250
- 1 more cores, run more applications at once: 2 vs 1
- Around 87% higher clock speed: 2 GHz vs 1.07 GHz
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Number of cores | 2 vs 1 |
Maximum frequency | 2 GHz vs 1.07 GHz |
L2 cache | 2 MB vs 1024 KB |
Compare benchmarks
CPU 1: Intel Core 2 Solo ULV U2100
CPU 2: Intel Core 2 Duo T7250
Name | Intel Core 2 Solo ULV U2100 | Intel Core 2 Duo T7250 |
---|---|---|
PassMark - Single thread mark | 771 | |
PassMark - CPU mark | 709 | |
Geekbench 4 - Single Core | 242 | |
Geekbench 4 - Multi-Core | 399 |
Compare specifications (specs)
Intel Core 2 Solo ULV U2100 | Intel Core 2 Duo T7250 | |
---|---|---|
Essentials |
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Architecture codename | Merom | Merom |
Launch date | September 2007 | 2 August 2007 |
Place in performance rating | not rated | 2951 |
Processor Number | U2100 | T7250 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Mobile |
Price now | $201.48 | |
Value for money (0-100) | 1.62 | |
Performance |
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64 bit support | ||
Base frequency | 1.06 GHz | 2.00 GHz |
Bus Speed | 533 MHz FSB | 800 MHz FSB |
Die size | 143 mm2 | 143 mm2 |
L1 cache | 64 KB | 64 KB |
L2 cache | 1024 KB | 2 MB |
Manufacturing process technology | 65 nm | 65 nm |
Maximum core temperature | 100°C | 100°C |
Maximum frequency | 1.07 GHz | 2 GHz |
Number of cores | 1 | 2 |
Transistor count | 291 million | 291 million |
VID voltage range | 0.80V-1.00V | 1.075V-1.175V |
Front-side bus (FSB) | 800 MHz | |
Number of threads | 2 | |
Memory |
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Supported memory types | DDR1 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 35mm x 35mm | 35mm x 35mm |
Sockets supported | Intel BGA 956 | PPGA478, PBGA479 |
Thermal Design Power (TDP) | 5.5 Watt | 35 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |