Intel Core Solo T1250 vs Intel Pentium D1519
Comparative analysis of Intel Core Solo T1250 and Intel Pentium D1519 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals.
Differences
Reasons to consider the Intel Pentium D1519
- 3 more cores, run more applications at once: 4 vs 1
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 65 nm
- Around 24% lower typical power consumption: 25 Watt vs 31 Watt
| Number of cores | 4 vs 1 |
| Manufacturing process technology | 14 nm vs 65 nm |
| Thermal Design Power (TDP) | 25 Watt vs 31 Watt |
Compare specifications (specs)
| Intel Core Solo T1250 | Intel Pentium D1519 | |
|---|---|---|
Essentials |
||
| Architecture codename | Yonah | Broadwell |
| Place in performance rating | not rated | not rated |
| Processor Number | T1250 | D1519 |
| Series | Legacy Intel® Core™ Processors | Intel® Pentium® Processor D Series |
| Status | Discontinued | Launched |
| Vertical segment | Mobile | Server |
| Launch date | Q2'16 | |
Performance |
||
| Base frequency | 1.73 GHz | 1.50 GHz |
| Bus Speed | 533 MHz FSB | |
| Die size | 90 mm2 | |
| Manufacturing process technology | 65 nm | 14 nm |
| Maximum core temperature | 100°C | |
| Number of cores | 1 | 4 |
| Transistor count | 151 million | |
| 64 bit support | ||
| Maximum frequency | 2.10 GHz | |
| Number of threads | 8 | |
| Operating Temperature Range | -40°C to 85°C | |
Compatibility |
||
| Low Halogen Options Available | ||
| Package Size | 35mm x 35mm | 37.5mm x 37.5mm |
| Thermal Design Power (TDP) | 31 Watt | 25 Watt |
| Max number of CPUs in a configuration | 1 | |
| Sockets supported | FCBGA1667 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Physical Address Extensions (PAE) | 32-bit | |
| General-Purpose Input/Output (GPIO) | ||
| Instruction set extensions | Intel® AVX2 | |
| Intel® AES New Instructions | ||
| Intel® TSX-NI | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
||
| Max memory channels | 2 | |
| Maximum memory size | 128 GB | |
| Supported memory frequency | 2133 MHz | |
| Supported memory types | DDR4, DDR3 | |
Peripherals |
||
| Integrated LAN | ||
| Max number of PCIe lanes | 32 | |
| Number of USB ports | 8 | |
| PCI Express revision | 2.0/3.0 | |
| PCIe configurations | x4 x8 x16 | |
| Scalability | 1S Only | |
| Total number of SATA ports | 6 | |
| UART | ||
| USB revision | 2.0/3.0 | |
Navigation
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