Intel Core i3-10100F vs Intel Core i5-4670R
Comparative analysis of Intel Core i3-10100F and Intel Core i5-4670R processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Core i3-10100F
- 4 more threads: 8 vs 4
- Around 16% higher clock speed: 4.30 GHz vs 3.70 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- 4x more maximum memory size: 128 GB vs 32 GB
- Around 20% better performance in PassMark - Single thread mark: 2593 vs 2164
- Around 67% better performance in PassMark - CPU mark: 8759 vs 5233
Specifications (specs) | |
Number of threads | 8 vs 4 |
Maximum frequency | 4.30 GHz vs 3.70 GHz |
Manufacturing process technology | 14 nm vs 22 nm |
L3 cache | 6 MB vs 4096 KB (shared) |
Maximum memory size | 128 GB vs 32 GB |
Benchmarks | |
PassMark - Single thread mark | 2593 vs 2164 |
PassMark - CPU mark | 8759 vs 5233 |
Reasons to consider the Intel Core i5-4670R
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
Unlocked | Unlocked vs Locked |
Compare benchmarks
CPU 1: Intel Core i3-10100F
CPU 2: Intel Core i5-4670R
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-10100F | Intel Core i5-4670R |
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PassMark - Single thread mark | 2593 | 2164 |
PassMark - CPU mark | 8759 | 5233 |
3DMark Fire Strike - Physics Score | 3176 |
Compare specifications (specs)
Intel Core i3-10100F | Intel Core i5-4670R | |
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Essentials |
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Architecture codename | Comet Lake | Crystal Well |
Launch date | Q4'20 | June 2013 |
Launch price (MSRP) | $79 - $97 | |
Place in performance rating | 1180 | 1178 |
Processor Number | i3-10100F | i5-4670R |
Series | 10th Generation Intel Core i3 Processors | 4th Generation Intel® Core™ i5 Processors |
Status | Launched | Discontinued |
Vertical segment | Desktop | Desktop |
Price now | $276 | |
Value for money (0-100) | 7.92 | |
Performance |
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64 bit support | ||
Base frequency | 3.60 GHz | 3.00 GHz |
Bus Speed | 8 GT/s | 5 GT/s DMI2 |
L1 cache | 256 KB | 64 KB (per core) |
L2 cache | 1 MB | 256 KB (per core) |
L3 cache | 6 MB | 4096 KB (shared) |
Manufacturing process technology | 14 nm | 22 nm |
Maximum core temperature | 100°C | |
Maximum frequency | 4.30 GHz | 3.70 GHz |
Number of cores | 4 | 4 |
Number of threads | 8 | 4 |
Die size | 177 mm | |
Maximum case temperature (TCase) | 71 °C | |
Number of QPI Links | 0 | |
Transistor count | 1400 million | |
Unlocked | ||
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 41.6 GB/s | 25.6 GB/s |
Maximum memory size | 128 GB | 32 GB |
Supported memory types | DDR4-2666 | DDR3 and DDR3L 1333/1600 at 1.5V |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | 37.5mm x 32mm x 1.65mm |
Sockets supported | FCLGA1200 | FCBGA1364 |
Thermal Design Power (TDP) | 65 Watt | 65 Watt |
Thermal Solution | PCG 2015C | |
Low Halogen Options Available | ||
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | Up to 1x16, 2x8, 1x8/2x4 |
Scalability | 1S Only | 1S Only |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Anti-Theft technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Thermal Velocity Boost | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® My WiFi technology | ||
Intel® TSX-NI | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
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Device ID | 0xD22 | |
Graphics base frequency | 200 MHz | |
Graphics max dynamic frequency | 1.30 GHz | |
Graphics max frequency | 1.3 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 2 GB | |
Processor graphics | Intel® Iris® Pro Graphics 5200 | |
Graphics interfaces |
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DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
VGA | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over eDP | 3840x2160@60Hz | |
Max resolution over HDMI 1.4 | 3840x2160@60Hz | |
Max resolution over VGA | 2880x1800@60Hz | |
Graphics API support |
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DirectX | 11.2/12 | |
OpenGL | 4.3 |