Intel Core i3-10100Y vs AMD Ryzen 5 PRO 3500U
Comparative analysis of Intel Core i3-10100Y and AMD Ryzen 5 PRO 3500U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-10100Y
- Around 5% higher clock speed: 3.90 GHz vs 3.7 GHz
- Around 5% higher maximum core temperature: 100°C vs 95 °C
- 3x lower typical power consumption: 5 Watt vs 15 Watt
Maximum frequency | 3.90 GHz vs 3.7 GHz |
Maximum core temperature | 100°C vs 95 °C |
Thermal Design Power (TDP) | 5 Watt vs 15 Watt |
Reasons to consider the AMD Ryzen 5 PRO 3500U
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 14 nm
- 2x more maximum memory size: 32 GB vs 16 GB
- Around 21% better performance in PassMark - Single thread mark: 1963 vs 1617
- 2.5x better performance in PassMark - CPU mark: 7033 vs 2857
Specifications (specs) | |
Manufacturing process technology | 12 nm vs 14 nm |
Maximum memory size | 32 GB vs 16 GB |
Benchmarks | |
PassMark - Single thread mark | 1963 vs 1617 |
PassMark - CPU mark | 7033 vs 2857 |
Compare benchmarks
CPU 1: Intel Core i3-10100Y
CPU 2: AMD Ryzen 5 PRO 3500U
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-10100Y | AMD Ryzen 5 PRO 3500U |
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PassMark - Single thread mark | 1617 | 1963 |
PassMark - CPU mark | 2857 | 7033 |
Geekbench 4 - Single Core | 712 | |
Geekbench 4 - Multi-Core | 2529 |
Compare specifications (specs)
Intel Core i3-10100Y | AMD Ryzen 5 PRO 3500U | |
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Essentials |
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Architecture codename | Amber Lake Y | Zen+ |
Launch date | Q1'21 | 8 April 2019 |
Place in performance rating | 1591 | 1699 |
Processor Number | i3-10100Y | PRO 3500U |
Series | 10th Generation Intel Core i3 Processors | 3000 |
Status | Launched | |
Vertical segment | Mobile | Mobile |
Family | Ryzen 5 | |
OPN Tray | YM350BC4T4MFG | |
Performance |
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64 bit support | ||
Base frequency | 1.30 GHz | 2.1 GHz |
Bus Speed | 4 GT/s | |
Manufacturing process technology | 14 nm | 12 nm |
Maximum core temperature | 100°C | 95 °C |
Maximum frequency | 3.90 GHz | 3.7 GHz |
L1 cache | 384 KB | |
L2 cache | 2 MB | |
L3 cache | 4 MB | |
Number of cores | 4 | |
Number of GPU cores | 8 | |
Number of threads | 8 | |
Transistor count | 4940 million | |
Unlocked | ||
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 33.3 GB/s | 35.76 GB/s |
Maximum memory size | 16 GB | 32 GB |
Supported memory types | LPDDR3-1866, DDR3L-1600 | DDR4-2400 |
ECC memory support | ||
Supported memory frequency | 2400 MHz | |
Graphics |
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Device ID | 0x591C | |
Execution Units | 24 | 8 |
Graphics base frequency | 300 MHz | 1200 MHz |
Graphics max dynamic frequency | 1.00 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® Quick Sync Video | ||
Max video memory | 16 GB | |
Processor graphics | Intel UHD Graphics 615 | Radeon Vega 8 Graphics |
iGPU core count | 8 | |
Number of pipelines | 512 | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 4 |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over eDP | 3840x2160@60Hz | |
Graphics API support |
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DirectX | 12 | 12 |
OpenGL | 4.5 | 4.6 |
Compatibility |
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Configurable TDP-down | 3.5 Watt | |
Configurable TDP-down Frequency | 600 MHz | |
Configurable TDP-up | 7 Watt | |
Configurable TDP-up Frequency | 1.60 GHz | |
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 20mm X 16.5mm | |
Thermal Design Power (TDP) | 5 Watt | 15 Watt |
Configurable TDP | 12-25 Watt | |
Sockets supported | FP5 | |
Peripherals |
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Max number of PCIe lanes | 10 | 12 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | 1x4, 2x2, 1x2+2x1 and 4x1 | 1x8+1x4, 2x4+1x4 |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Turbo Boost technology | ||
Speed Shift technology | ||
Thermal Monitoring | ||
AMD SenseMI | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |