Intel Core i3-2100T vs AMD Phenom II X2 565 BE

Comparative analysis of Intel Core i3-2100T and AMD Phenom II X2 565 BE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core i3-2100T

  • CPU is newer: launch date 2 month(s) later
  • 2 more threads: 4 vs 2
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
  • 2.3x lower typical power consumption: 35 Watt vs 80 Watt
  • Around 4% better performance in PassMark - CPU mark: 1501 vs 1442
  • Around 11% better performance in Geekbench 4 - Single Core: 2356 vs 2117
  • Around 23% better performance in Geekbench 4 - Multi-Core: 4444 vs 3616
Specifications (specs)
Launch date February 2011 vs December 2010
Number of threads 4 vs 2
Manufacturing process technology 32 nm vs 45 nm
Thermal Design Power (TDP) 35 Watt vs 80 Watt
Benchmarks
PassMark - CPU mark 1501 vs 1442
Geekbench 4 - Single Core 2356 vs 2117
Geekbench 4 - Multi-Core 4444 vs 3616

Reasons to consider the AMD Phenom II X2 565 BE

  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • Around 36% higher clock speed: 3.4 GHz vs 2.5 GHz
  • Around 8% higher maximum core temperature: 70°C vs 65.0°C
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 2x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 25% better performance in PassMark - Single thread mark: 1376 vs 1100
Specifications (specs)
Unlocked Unlocked vs Locked
Maximum frequency 3.4 GHz vs 2.5 GHz
Maximum core temperature 70°C vs 65.0°C
L1 cache 256 KB vs 64 KB (per core)
L2 cache 1 MB vs 256 KB (per core)
L3 cache 6 MB vs 3072 KB (shared)
Benchmarks
PassMark - Single thread mark 1376 vs 1100

Compare benchmarks

CPU 1: Intel Core i3-2100T
CPU 2: AMD Phenom II X2 565 BE

PassMark - Single thread mark
CPU 1
CPU 2
1100
1376
PassMark - CPU mark
CPU 1
CPU 2
1501
1442
Geekbench 4 - Single Core
CPU 1
CPU 2
2356
2117
Geekbench 4 - Multi-Core
CPU 1
CPU 2
4444
3616
Name Intel Core i3-2100T AMD Phenom II X2 565 BE
PassMark - Single thread mark 1100 1376
PassMark - CPU mark 1501 1442
Geekbench 4 - Single Core 2356 2117
Geekbench 4 - Multi-Core 4444 3616

Compare specifications (specs)

Intel Core i3-2100T AMD Phenom II X2 565 BE

Essentials

Architecture codename Sandy Bridge Callisto
Launch date February 2011 December 2010
Launch price (MSRP) $180
Place in performance rating 1412 1440
Price now $59.99
Processor Number i3-2100T
Series Legacy Intel® Core™ Processors AMD Phenom II X2
Status Discontinued
Value for money (0-100) 14.40
Vertical segment Desktop Desktop
Family AMD Phenom
OPN PIB HDZ565WFGMBOX
OPN Tray HDZ565WFK2DGM

Performance

64 bit support
Base frequency 2.50 GHz 3.4 GHz
Bus Speed 5 GT/s DMI
Die size 131 mm 258 mm
L1 cache 64 KB (per core) 256 KB
L2 cache 256 KB (per core) 1 MB
L3 cache 3072 KB (shared) 6 MB
Manufacturing process technology 32 nm 45 nm
Maximum core temperature 65.0°C 70°C
Maximum frequency 2.5 GHz 3.4 GHz
Number of cores 2 2
Number of threads 4 2
Transistor count 504 million 758 million
Unlocked

Memory

Max memory channels 2
Maximum memory bandwidth 21 GB/s
Maximum memory size 32 GB
Supported memory types DDR3 1066/1333 DDR3

Graphics

Device ID 0x102
Graphics base frequency 650 MHz
Graphics max dynamic frequency 1.10 GHz
Graphics max frequency 1.1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 2000

Graphics interfaces

Number of displays supported 2
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm
Sockets supported FCLGA1155 AM3
Thermal Design Power (TDP) 35 Watt 80 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)