Intel Core i3-2100T vs AMD Phenom II X2 570 BE
Comparative analysis of Intel Core i3-2100T and AMD Phenom II X2 570 BE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-2100T
- CPU is newer: launch date 9 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 2.3x lower typical power consumption: 35 Watt vs 80 Watt
- Around 8% better performance in PassMark - CPU mark: 1501 vs 1395
- Around 12% better performance in Geekbench 4 - Single Core: 2356 vs 2107
- Around 23% better performance in Geekbench 4 - Multi-Core: 4444 vs 3615
Specifications (specs) | |
Launch date | February 2011 vs May 2010 |
Manufacturing process technology | 32 nm vs 45 nm |
Thermal Design Power (TDP) | 35 Watt vs 80 Watt |
Benchmarks | |
PassMark - CPU mark | 1501 vs 1395 |
Geekbench 4 - Single Core | 2356 vs 2107 |
Geekbench 4 - Multi-Core | 4444 vs 3615 |
Reasons to consider the AMD Phenom II X2 570 BE
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 40% higher clock speed: 3.5 GHz vs 2.5 GHz
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 28% better performance in PassMark - Single thread mark: 1412 vs 1100
Specifications (specs) | |
Unlocked | Unlocked vs Locked |
Maximum frequency | 3.5 GHz vs 2.5 GHz |
L1 cache | 128 KB (per core) vs 64 KB (per core) |
L2 cache | 512 KB (per core) vs 256 KB (per core) |
L3 cache | 6144 KB (shared) vs 3072 KB (shared) |
Benchmarks | |
PassMark - Single thread mark | 1412 vs 1100 |
Compare benchmarks
CPU 1: Intel Core i3-2100T
CPU 2: AMD Phenom II X2 570 BE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core i3-2100T | AMD Phenom II X2 570 BE |
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PassMark - Single thread mark | 1100 | 1412 |
PassMark - CPU mark | 1501 | 1395 |
Geekbench 4 - Single Core | 2356 | 2107 |
Geekbench 4 - Multi-Core | 4444 | 3615 |
Compare specifications (specs)
Intel Core i3-2100T | AMD Phenom II X2 570 BE | |
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Essentials |
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Architecture codename | Sandy Bridge | Callisto |
Launch date | February 2011 | May 2010 |
Launch price (MSRP) | $180 | |
Place in performance rating | 1414 | 1426 |
Price now | $59.99 | |
Processor Number | i3-2100T | |
Series | Legacy Intel® Core™ Processors | |
Status | Discontinued | |
Value for money (0-100) | 14.40 | |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 2.50 GHz | |
Bus Speed | 5 GT/s DMI | |
Die size | 131 mm | 258 mm |
L1 cache | 64 KB (per core) | 128 KB (per core) |
L2 cache | 256 KB (per core) | 512 KB (per core) |
L3 cache | 3072 KB (shared) | 6144 KB (shared) |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 65.0°C | |
Maximum frequency | 2.5 GHz | 3.5 GHz |
Number of cores | 2 | 2 |
Number of threads | 4 | |
Transistor count | 504 million | 758 million |
Unlocked | ||
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 21 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3 1066/1333 | DDR3 |
Graphics |
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Device ID | 0x102 | |
Graphics base frequency | 650 MHz | |
Graphics max dynamic frequency | 1.10 GHz | |
Graphics max frequency | 1.1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel® HD Graphics 2000 | |
Graphics interfaces |
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Number of displays supported | 2 | |
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1155 | AM3 |
Thermal Design Power (TDP) | 35 Watt | 80 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |