Intel Core i3-2310E vs Intel Core i3-390M
Comparative analysis of Intel Core i3-2310E and Intel Core i3-390M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-2310E
- CPU is newer: launch date 1 month(s) later
- Around 11% higher maximum core temperature: 100C (BGA) vs 90°C for rPGA, 105°C for BGA
- 2.1x more maximum memory size: 16.6 GB vs 8 GB
- Around 45% better performance in PassMark - CPU mark: 1845 vs 1276
Specifications (specs) | |
Launch date | February 2011 vs 4 December 2010 |
Maximum core temperature | 100C (BGA) vs 90°C for rPGA, 105°C for BGA |
Maximum memory size | 16.6 GB vs 8 GB |
Benchmarks | |
PassMark - CPU mark | 1845 vs 1276 |
Reasons to consider the Intel Core i3-390M
- Around 27% higher clock speed: 2.66 GHz vs 2.1 GHz
- Around 47% better performance in PassMark - Single thread mark: 1076 vs 733
Specifications (specs) | |
Maximum frequency | 2.66 GHz vs 2.1 GHz |
Benchmarks | |
PassMark - Single thread mark | 1076 vs 733 |
Compare benchmarks
CPU 1: Intel Core i3-2310E
CPU 2: Intel Core i3-390M
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-2310E | Intel Core i3-390M |
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PassMark - Single thread mark | 733 | 1076 |
PassMark - CPU mark | 1845 | 1276 |
Geekbench 4 - Single Core | 386 | |
Geekbench 4 - Multi-Core | 798 |
Compare specifications (specs)
Intel Core i3-2310E | Intel Core i3-390M | |
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Essentials |
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Architecture codename | Sandy Bridge | Arrandale |
Launch date | February 2011 | 4 December 2010 |
Launch price (MSRP) | $225 | $39 |
Place in performance rating | 2606 | 2607 |
Price now | $225 | $38.95 |
Processor Number | i3-2310E | i3-390M |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Launched | Discontinued |
Value for money (0-100) | 3.72 | 16.49 |
Vertical segment | Embedded | Mobile |
Performance |
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64 bit support | ||
Base frequency | 2.10 GHz | 2.66 GHz |
Die size | 149 mm | 81 mm2 |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 512 KB |
L3 cache | 3072 KB (shared) | 3072 KB |
Manufacturing process technology | 32 nm | 32 nm |
Maximum core temperature | 100C (BGA) | 90°C for rPGA, 105°C for BGA |
Maximum frequency | 2.1 GHz | 2.66 GHz |
Number of cores | 2 | 2 |
Number of threads | 4 | 4 |
Transistor count | 624 million | 382 million |
Bus Speed | 2.5 GT/s DMI | |
Front-side bus (FSB) | 2500 MHz | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 21.3 GB/s | 17.1 GB/s |
Maximum memory size | 16.6 GB | 8 GB |
Supported memory types | DDR3 1066/1333 | DDR3 800/1066 |
Graphics |
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Graphics base frequency | 650 MHz | 500 MHz |
Graphics max dynamic frequency | 1.05 GHz | 667 MHz |
Graphics max frequency | 1.05 GHz | 667 MHz |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel® HD Graphics 3000 | Intel HD Graphics |
Intel® Clear Video technology | ||
Graphics interfaces |
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CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 2 | 2 |
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 31mm x 24mm (BGA1023) | rPGA 37.5mmx 37.5mm, BGA 34mmx28mm |
Sockets supported | FCBGA1023 | BGA1288, PGA988 |
Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 2.0 | 2.0 |
PCIe configurations | 1x16, 2x8, 1x8+2x4 | 1x16 |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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4G WiMAX Wireless | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® AVX | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Physical Address Extensions (PAE) | 36-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |