Intel Core i3-2365M vs Intel Core 2 Duo T9900
Comparative analysis of Intel Core i3-2365M and Intel Core 2 Duo T9900 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i3-2365M
- CPU is newer: launch date 2 year(s) 2 month(s) later
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 2.1x lower typical power consumption: 17 Watt vs 35 Watt
Launch date | 27 June 2011 vs 1 April 2009 |
Number of threads | 4 vs 2 |
Manufacturing process technology | 32 nm vs 45 nm |
Thermal Design Power (TDP) | 17 Watt vs 35 Watt |
Reasons to consider the Intel Core 2 Duo T9900
- Around 119% higher clock speed: 3.06 GHz vs 1.4 GHz
- Around 5% higher maximum core temperature: 105°C vs 100 °C
- 12x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 94% better performance in PassMark - Single thread mark: 1185 vs 610
- Around 45% better performance in PassMark - CPU mark: 1189 vs 821
- Around 82% better performance in Geekbench 4 - Single Core: 444 vs 244
- Around 39% better performance in Geekbench 4 - Multi-Core: 760 vs 546
Specifications (specs) | |
Maximum frequency | 3.06 GHz vs 1.4 GHz |
Maximum core temperature | 105°C vs 100 °C |
L2 cache | 6134 KB vs 512 KB |
Benchmarks | |
PassMark - Single thread mark | 1185 vs 610 |
PassMark - CPU mark | 1189 vs 821 |
Geekbench 4 - Single Core | 444 vs 244 |
Geekbench 4 - Multi-Core | 760 vs 546 |
Compare benchmarks
CPU 1: Intel Core i3-2365M
CPU 2: Intel Core 2 Duo T9900
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core i3-2365M | Intel Core 2 Duo T9900 |
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PassMark - Single thread mark | 610 | 1185 |
PassMark - CPU mark | 821 | 1189 |
Geekbench 4 - Single Core | 244 | 444 |
Geekbench 4 - Multi-Core | 546 | 760 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.324 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 23.559 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.094 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.622 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 2.322 |
Compare specifications (specs)
Intel Core i3-2365M | Intel Core 2 Duo T9900 | |
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Essentials |
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Architecture codename | Sandy Bridge | Penryn |
Launch date | 27 June 2011 | 1 April 2009 |
Place in performance rating | 3057 | 3061 |
Processor Number | i3-2365M | T9900 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Launched | Discontinued |
Vertical segment | Mobile | Mobile |
Launch price (MSRP) | $530 | |
Price now | $398.95 | |
Value for money (0-100) | 1.57 | |
Performance |
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64 bit support | ||
Base frequency | 1.40 GHz | 3.06 GHz |
Bus Speed | 5 GT/s DMI | 1066 MHz FSB |
Die size | 149 mm | 107 mm2 |
L1 cache | 128 KB | 128 KB |
L2 cache | 512 KB | 6134 KB |
L3 cache | 3072 KB | |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 100 °C | 105°C |
Maximum frequency | 1.4 GHz | 3.06 GHz |
Number of cores | 2 | 2 |
Number of threads | 4 | 2 |
Transistor count | 624 Million | 410 million |
Front-side bus (FSB) | 1066 MHz | |
VID voltage range | 1.050V-1.2125V | |
Memory |
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Max memory channels | 2 | |
Maximum memory size | 16 GB | |
Supported memory types | DDR3 1066/1333 | |
Graphics |
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Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.00 GHz | |
Graphics max frequency | 1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics interfaces |
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CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 2 | |
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 31.0mm x 24.0mm (BGA1023) | 35mm |
Sockets supported | FCBGA1023 | BGA479, PGA478 |
Thermal Design Power (TDP) | 17 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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4G WiMAX Wireless | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |