Intel Core i3-2367M vs Intel Celeron Dual-Core SU2300
Comparative analysis of Intel Core i3-2367M and Intel Celeron Dual-Core SU2300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s).
Differences
Reasons to consider the Intel Core i3-2367M
- CPU is newer: launch date 1 year(s) 9 month(s) later
- 2 more threads: 4 vs 2
- Around 17% higher clock speed: 1.4 GHz vs 1.2 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- Around 22% better performance in PassMark - Single thread mark: 621 vs 507
- Around 76% better performance in PassMark - CPU mark: 847 vs 482
- Around 66% better performance in Geekbench 4 - Single Core: 258 vs 155
- 2x better performance in Geekbench 4 - Multi-Core: 582 vs 286
Specifications (specs) | |
Launch date | 27 June 2011 vs 1 September 2009 |
Number of threads | 4 vs 2 |
Maximum frequency | 1.4 GHz vs 1.2 GHz |
Manufacturing process technology | 32 nm vs 45 nm |
Benchmarks | |
PassMark - Single thread mark | 621 vs 507 |
PassMark - CPU mark | 847 vs 482 |
Geekbench 4 - Single Core | 258 vs 155 |
Geekbench 4 - Multi-Core | 582 vs 286 |
Reasons to consider the Intel Celeron Dual-Core SU2300
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 70% lower typical power consumption: 10 Watt vs 17 Watt
L2 cache | 1 MB vs 512 KB |
Thermal Design Power (TDP) | 10 Watt vs 17 Watt |
Compare benchmarks
CPU 1: Intel Core i3-2367M
CPU 2: Intel Celeron Dual-Core SU2300
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core i3-2367M | Intel Celeron Dual-Core SU2300 |
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PassMark - Single thread mark | 621 | 507 |
PassMark - CPU mark | 847 | 482 |
Geekbench 4 - Single Core | 258 | 155 |
Geekbench 4 - Multi-Core | 582 | 286 |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 5.331 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.039 |
Compare specifications (specs)
Intel Core i3-2367M | Intel Celeron Dual-Core SU2300 | |
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Essentials |
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Architecture codename | Sandy Bridge | Penryn |
Launch date | 27 June 2011 | 1 September 2009 |
Place in performance rating | 3210 | 3204 |
Processor Number | i3-2367M | SU2300 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Celeron® Processor |
Status | Launched | Discontinued |
Vertical segment | Mobile | Mobile |
Launch price (MSRP) | $134 | |
Performance |
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64 bit support | ||
Base frequency | 1.40 GHz | 1.20 GHz |
Bus Speed | 5 GT/s DMI | 800 MHz FSB |
Die size | 149 mm | 107 mm2 |
L1 cache | 128 KB | |
L2 cache | 512 KB | 1 MB |
L3 cache | 3072 KB | |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 100C | 100°C |
Maximum frequency | 1.4 GHz | 1.2 GHz |
Number of cores | 2 | 2 |
Number of threads | 4 | 2 |
Transistor count | 624 Million | 410 million |
Front-side bus (FSB) | 800 MHz | |
Memory |
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Max memory channels | 2 | |
Maximum memory size | 16 GB | |
Supported memory types | DDR3 1066/1333 | |
Graphics |
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Device ID | 0x116 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.00 GHz | |
Graphics max frequency | 1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel® HD Graphics 3000 | |
Graphics interfaces |
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CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 2 | |
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 31.0mm x 24.0mm (BGA1023) | 22mm x 22mm |
Sockets supported | FCBGA1023 | BGA956 |
Thermal Design Power (TDP) | 17 Watt | 10 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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4G WiMAX Wireless | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |