Intel Core i3-2367M vs Intel Core 2 Duo SP9300
Comparative analysis of Intel Core i3-2367M and Intel Core 2 Duo SP9300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s).
Differences
Reasons to consider the Intel Core i3-2367M
- CPU is newer: launch date 2 year(s) 10 month(s) later
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- Around 47% lower typical power consumption: 17 Watt vs 25 Watt
- Around 2% better performance in Geekbench 4 - Multi-Core: 582 vs 568
| Specifications (specs) | |
| Launch date | 27 June 2011 vs 20 August 2008 |
| Number of threads | 4 vs 2 |
| Manufacturing process technology | 32 nm vs 45 nm |
| Thermal Design Power (TDP) | 17 Watt vs 25 Watt |
| Benchmarks | |
| Geekbench 4 - Multi-Core | 582 vs 568 |
Reasons to consider the Intel Core 2 Duo SP9300
- Around 61% higher clock speed: 2.26 GHz vs 1.4 GHz
- Around 5% higher maximum core temperature: 105°C vs 100C
- 12x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 15% better performance in Geekbench 4 - Single Core: 297 vs 258
| Specifications (specs) | |
| Maximum frequency | 2.26 GHz vs 1.4 GHz |
| Maximum core temperature | 105°C vs 100C |
| L2 cache | 6 MB vs 512 KB |
| Benchmarks | |
| Geekbench 4 - Single Core | 297 vs 258 |
Compare benchmarks
CPU 1: Intel Core i3-2367M
CPU 2: Intel Core 2 Duo SP9300
| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Core i3-2367M | Intel Core 2 Duo SP9300 |
|---|---|---|
| PassMark - Single thread mark | 621 | |
| PassMark - CPU mark | 847 | |
| Geekbench 4 - Single Core | 258 | 297 |
| Geekbench 4 - Multi-Core | 582 | 568 |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 5.331 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.039 |
Compare specifications (specs)
| Intel Core i3-2367M | Intel Core 2 Duo SP9300 | |
|---|---|---|
Essentials |
||
| Architecture codename | Sandy Bridge | Penryn |
| Launch date | 27 June 2011 | 20 August 2008 |
| Place in performance rating | 3202 | 3206 |
| Processor Number | i3-2367M | SP9300 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
| Status | Launched | Discontinued |
| Vertical segment | Mobile | Mobile |
| Launch price (MSRP) | $284 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.40 GHz | 2.26 GHz |
| Bus Speed | 5 GT/s DMI | 1066 MHz FSB |
| Die size | 149 mm | 107 mm2 |
| L1 cache | 128 KB | |
| L2 cache | 512 KB | 6 MB |
| L3 cache | 3072 KB | |
| Manufacturing process technology | 32 nm | 45 nm |
| Maximum core temperature | 100C | 105°C |
| Maximum frequency | 1.4 GHz | 2.26 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 2 |
| Transistor count | 624 Million | 410 million |
| Front-side bus (FSB) | 1066 MHz | |
| VID voltage range | 1.050V - 1.150V | |
Memory |
||
| Max memory channels | 2 | |
| Maximum memory size | 16 GB | |
| Supported memory types | DDR3 1066/1333 | |
Graphics |
||
| Device ID | 0x116 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.00 GHz | |
| Graphics max frequency | 1 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel® HD Graphics 3000 | |
Graphics interfaces |
||
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 31.0mm x 24.0mm (BGA1023) | 22mm x 22mm |
| Sockets supported | FCBGA1023 | BGA956 |
| Thermal Design Power (TDP) | 17 Watt | 25 Watt |
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
||
| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| FSB parity | ||
Virtualization |
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| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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