Intel Core i3-2377M vs Intel Core 2 Duo T8300

Comparative analysis of Intel Core i3-2377M and Intel Core 2 Duo T8300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the Intel Core i3-2377M

  • CPU is newer: launch date 3 year(s) 6 month(s) later
  • 2 more threads: 4 vs 2
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
  • 2.1x lower typical power consumption: 17 Watt vs 35 Watt
  • Around 13% better performance in Geekbench 4 - Multi-Core: 604 vs 535
  • 3.9x better performance in CompuBench 1.5 Desktop - Face Detection (mPixels/s): 1 vs 0.259
  • Around 11% better performance in CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s): 17.6 vs 15.787
  • Around 28% better performance in CompuBench 1.5 Desktop - T-Rex (Frames/s): 0.096 vs 0.075
Specifications (specs)
Launch date 1 August 2011 vs 10 January 2008
Number of threads 4 vs 2
Manufacturing process technology 32 nm vs 45 nm
Thermal Design Power (TDP) 17 Watt vs 35 Watt
Benchmarks
Geekbench 4 - Multi-Core 604 vs 535
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 1 vs 0.259
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 17.6 vs 15.787
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.096 vs 0.075

Reasons to consider the Intel Core 2 Duo T8300

  • Around 60% higher clock speed: 2.4 GHz vs 1.5 GHz
  • Around 5% higher maximum core temperature: 105°C vs 100 °C
  • 6x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 57% better performance in PassMark - Single thread mark: 969 vs 619
  • Around 7% better performance in PassMark - CPU mark: 894 vs 838
  • Around 20% better performance in Geekbench 4 - Single Core: 321 vs 268
Specifications (specs)
Maximum frequency 2.4 GHz vs 1.5 GHz
Maximum core temperature 105°C vs 100 °C
L2 cache 3072 KB vs 512 KB
Benchmarks
PassMark - Single thread mark 969 vs 619
PassMark - CPU mark 894 vs 838
Geekbench 4 - Single Core 321 vs 268

Compare benchmarks

CPU 1: Intel Core i3-2377M
CPU 2: Intel Core 2 Duo T8300

PassMark - Single thread mark
CPU 1
CPU 2
619
969
PassMark - CPU mark
CPU 1
CPU 2
838
894
Geekbench 4 - Single Core
CPU 1
CPU 2
268
321
Geekbench 4 - Multi-Core
CPU 1
CPU 2
604
535
CompuBench 1.5 Desktop - Face Detection (mPixels/s)
CPU 1
CPU 2
1
0.259
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)
CPU 1
CPU 2
17.6
15.787
CompuBench 1.5 Desktop - T-Rex (Frames/s)
CPU 1
CPU 2
0.096
0.075
Name Intel Core i3-2377M Intel Core 2 Duo T8300
PassMark - Single thread mark 619 969
PassMark - CPU mark 838 894
Geekbench 4 - Single Core 268 321
Geekbench 4 - Multi-Core 604 535
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 1 0.259
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 17.6 15.787
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.096 0.075
CompuBench 1.5 Desktop - Video Composition (Frames/s) 0.479
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 1.875

Compare specifications (specs)

Intel Core i3-2377M Intel Core 2 Duo T8300

Essentials

Architecture codename Sandy Bridge Penryn
Launch date 1 August 2011 10 January 2008
Place in performance rating 3201 3196
Processor Number i3-2377M T8300
Series Legacy Intel® Core™ Processors Legacy Intel® Core™ Processors
Status Launched Discontinued
Vertical segment Mobile Mobile
Launch price (MSRP) $241
Price now $213.99
Value for money (0-100) 2.03

Performance

64 bit support
Base frequency 1.50 GHz 2.40 GHz
Bus Speed 5 GT/s DMI 800 MHz FSB
Die size 149 mm 107 mm2
L1 cache 128 KB
L2 cache 512 KB 3072 KB
L3 cache 3072 KB
Manufacturing process technology 32 nm 45 nm
Maximum core temperature 100 °C 105°C
Maximum frequency 1.5 GHz 2.4 GHz
Number of cores 2 2
Number of threads 4 2
Transistor count 624 Million 410 million
Front-side bus (FSB) 800 MHz
VID voltage range 1.000V-1.250V

Memory

Max memory channels 2
Maximum memory size 16 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.00 GHz
Graphics max frequency 1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 31.0mm x 24.0mm (BGA1023) 35mm x 35mm
Sockets supported FCBGA1023 PGA478, BGA479
Thermal Design Power (TDP) 17 Watt 35 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

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