Intel Core i3-3250T vs AMD Phenom II X4 830

Comparative analysis of Intel Core i3-3250T and AMD Phenom II X4 830 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core i3-3250T

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
  • 2.7x lower typical power consumption: 35 Watt vs 95 Watt
  • Around 55% better performance in PassMark - Single thread mark: 1684 vs 1084
  • Around 28% better performance in PassMark - CPU mark: 2650 vs 2070
Specifications (specs)
Manufacturing process technology 22 nm vs 45 nm
Thermal Design Power (TDP) 35 Watt vs 95 Watt
Benchmarks
PassMark - Single thread mark 1684 vs 1084
PassMark - CPU mark 2650 vs 2070

Reasons to consider the AMD Phenom II X4 830

  • 2 more cores, run more applications at once: 4 vs 2
Number of cores 4 vs 2

Compare benchmarks

CPU 1: Intel Core i3-3250T
CPU 2: AMD Phenom II X4 830

PassMark - Single thread mark
CPU 1
CPU 2
1684
1084
PassMark - CPU mark
CPU 1
CPU 2
2650
2070
Name Intel Core i3-3250T AMD Phenom II X4 830
PassMark - Single thread mark 1684 1084
PassMark - CPU mark 2650 2070
Geekbench 4 - Single Core 1838
Geekbench 4 - Multi-Core 5258

Compare specifications (specs)

Intel Core i3-3250T AMD Phenom II X4 830

Essentials

Architecture codename Ivy Bridge Deneb
Launch date Q2'13 September 2009
Place in performance rating 1548 1552
Processor Number i3-3250T
Series Legacy Intel® Core™ Processors
Status Launched
Vertical segment Desktop Desktop
Launch price (MSRP) $80
Price now $79.95
Value for money (0-100) 12.66

Performance

64 bit support
Base frequency 3.00 GHz
Bus Speed 5 GT/s DMI
Manufacturing process technology 22 nm 45 nm
Maximum core temperature 65.0°C
Number of cores 2 4
Number of threads 4
Die size 258 mm
L1 cache 128 KB (per core)
L2 cache 512 KB (per core)
L3 cache 4096 KB (shared)
Maximum frequency 2.8 GHz
Transistor count 758 million

Memory

Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3 1333/1600 DDR3

Graphics

Device ID 0x152
Graphics base frequency 650 MHz
Graphics max dynamic frequency 1.05 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 2500

Graphics interfaces

Number of displays supported 3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm
Sockets supported FCLGA1155 AM3
Thermal Design Power (TDP) 35 Watt 95 Watt
Thermal Solution 2011A

Peripherals

PCI Express revision 2.0
PCIe configurations up to 1x16, 2x8, 1x8 & 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)