Intel Core i3-4170 vs AMD Phenom II X3 B77
Comparative analysis of Intel Core i3-4170 and AMD Phenom II X3 B77 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-4170
- 1 more threads: 4 vs 3
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- Around 76% lower typical power consumption: 54 Watt vs 95 Watt
- Around 57% better performance in PassMark - Single thread mark: 2053 vs 1310
- Around 94% better performance in PassMark - CPU mark: 3583 vs 1844
Specifications (specs) | |
Number of threads | 4 vs 3 |
Manufacturing process technology | 22 nm vs 45 nm |
Thermal Design Power (TDP) | 54 Watt vs 95 Watt |
Benchmarks | |
PassMark - Single thread mark | 2053 vs 1310 |
PassMark - CPU mark | 3583 vs 1844 |
Reasons to consider the AMD Phenom II X3 B77
- 1 more cores, run more applications at once: 3 vs 2
Number of cores | 3 vs 2 |
Compare benchmarks
CPU 1: Intel Core i3-4170
CPU 2: AMD Phenom II X3 B77
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-4170 | AMD Phenom II X3 B77 |
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PassMark - Single thread mark | 2053 | 1310 |
PassMark - CPU mark | 3583 | 1844 |
Geekbench 4 - Single Core | 823 | |
Geekbench 4 - Multi-Core | 1743 | |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 2.614 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 46.136 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.297 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.273 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 3.137 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 870 | |
GFXBench 4.0 - Manhattan (Frames) | 2169 | |
GFXBench 4.0 - T-Rex (Frames) | 3711 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 870 | |
GFXBench 4.0 - Manhattan (Fps) | 2169 | |
GFXBench 4.0 - T-Rex (Fps) | 3711 |
Compare specifications (specs)
Intel Core i3-4170 | AMD Phenom II X3 B77 | |
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Essentials |
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Architecture codename | Haswell | Heka |
Launch date | Q1'15 | May 2010 |
Place in performance rating | 1940 | 1936 |
Processor Number | i3-4170 | |
Series | 4th Generation Intel® Core™ i3 Processors | AMD Business Class - AMD Phenom X3 Triple-Core |
Status | Discontinued | |
Vertical segment | Desktop | Desktop |
Family | AMD Phenom | |
OPN Tray | HDXB77WFK3DGM | |
Price now | $26.59 | |
Value for money (0-100) | 33.97 | |
Performance |
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64 bit support | ||
Base frequency | 3.70 GHz | 3.2 GHz |
Bus Speed | 5 GT/s DMI2 | |
Manufacturing process technology | 22 nm | 45 nm |
Maximum core temperature | 72°C | |
Number of cores | 2 | 3 |
Number of threads | 4 | 3 |
Die size | 258 mm | |
L1 cache | 128 KB (per core) | |
L2 cache | 512 KB (per core) | |
L3 cache | 6144 KB (shared) | |
Maximum frequency | 3.2 GHz | |
Transistor count | 758 million | |
Unlocked | ||
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V | DDR3 |
Graphics |
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Device ID | 0x41E | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.15 GHz | |
Intel® Clear Video HD technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 2 GB | |
Processor graphics | Intel® HD Graphics 4400 | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
VGA | ||
Graphics image quality |
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Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over eDP | 3840x2160@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Max resolution over VGA | 1920x1200@60Hz | |
Graphics API support |
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DirectX | 11.1/12 | |
OpenGL | 4.3 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1150 | AM3 |
Thermal Design Power (TDP) | 54 Watt | 95 Watt |
Thermal Solution | PCG 2013C | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | Up to 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |