Intel Core i3-4340TE vs Intel Core i3-4110E

Comparative analysis of Intel Core i3-4340TE and Intel Core i3-4110E processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.

Intel Core i3-4340TE

Intel Core i3-4110E

Differences

Reasons to consider the Intel Core i3-4340TE

Around 6% lower typical power consumption: 35 Watt vs 37 Watt

Thermal Design Power (TDP)	35 Watt vs 37 Watt

Reasons to consider the Intel Core i3-4110E

Around 39% higher maximum core temperature: 100°C vs 72°C

Maximum core temperature	100°C vs 72°C

Compare specifications (specs)

	Intel Core i3-4340TE	Intel Core i3-4110E
Essentials
Architecture codename	Haswell	Haswell
Launch date	Q2'14	Q2'14
Place in performance rating	not rated	not rated
Processor Number	i3-4340TE	i3-4110E
Series	4th Generation Intel® Core™ i3 Processors	4th Generation Intel® Core™ i3 Processors
Status	Launched	Launched
Vertical segment	Embedded	Embedded
Performance
64 bit support
Base frequency	2.60 GHz	2.60 GHz
Bus Speed	5 GT/s DMI2	5 GT/s DMI2
Manufacturing process technology	22 nm	22 nm
Maximum core temperature	72°C	100°C
Number of cores	2	2
Number of QPI Links	0
Number of threads	4	4
Memory
Max memory channels	2	2
Maximum memory bandwidth	25.6 GB/s	25.6 GB/s
Maximum memory size	32 GB	32 GB
Supported memory types	DDR3 1333/1600	DDR3L 1333/1600
Graphics
Graphics base frequency	350 MHz	400 MHz
Graphics max dynamic frequency	1.00 GHz	900 MHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	1.7 GB
Processor graphics	Intel® HD Graphics 4600	Intel® HD Graphics 4600
Intel® Flexible Display Interface (Intel® FDI)
Graphics interfaces
Number of displays supported	3	3
DisplayPort
eDP
HDMI
VGA
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	37.5mm x 32mm x 1.6mm
Sockets supported	FCLGA1150	FCBGA1364
Thermal Design Power (TDP)	35 Watt	37 Watt
Thermal Solution	PCG 2013A
Peripherals
Max number of PCIe lanes	16	16
PCI Express revision	3.0	3.0
PCIe configurations	Up to 1x16, 2x8, 1x8/2x4	Up to 1x16, 2x8, 1x8 2x4
Scalability	1S Only	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Intel® OS Guard
Intel® Secure Key technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)