Intel Core i3-6006U vs Intel Core i3-330M
Comparative analysis of Intel Core i3-6006U and Intel Core i3-330M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-6006U
- CPU is newer: launch date 6 year(s) 10 month(s) later
- Around 11% higher maximum core temperature: 100°C vs 90°C for rPGA, 105°C for BGA
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
- 4x more maximum memory size: 32 GB vs 8 GB
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
- Around 42% better performance in PassMark - Single thread mark: 1151 vs 813
- 2.2x better performance in PassMark - CPU mark: 2275 vs 1027
- Around 55% better performance in Geekbench 4 - Single Core: 491 vs 317
- Around 61% better performance in Geekbench 4 - Multi-Core: 1112 vs 689
| Specifications (specs) | |
| Launch date | 11 November 2016 vs 10 January 2010 |
| Maximum core temperature | 100°C vs 90°C for rPGA, 105°C for BGA |
| Manufacturing process technology | 14 nm vs 32 nm |
| Maximum memory size | 32 GB vs 8 GB |
| Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 1151 vs 813 |
| PassMark - CPU mark | 2275 vs 1027 |
| Geekbench 4 - Single Core | 491 vs 317 |
| Geekbench 4 - Multi-Core | 1112 vs 689 |
Reasons to consider the Intel Core i3-330M
- Around 7% higher clock speed: 2.13 GHz vs 2 GHz
- Around 14% better performance in CompuBench 1.5 Desktop - Face Detection (mPixels/s): 1.641 vs 1.434
| Specifications (specs) | |
| Maximum frequency | 2.13 GHz vs 2 GHz |
| Benchmarks | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.641 vs 1.434 |
Compare benchmarks
CPU 1: Intel Core i3-6006U
CPU 2: Intel Core i3-330M
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| CompuBench 1.5 Desktop - Face Detection (mPixels/s) |
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| Name | Intel Core i3-6006U | Intel Core i3-330M |
|---|---|---|
| PassMark - Single thread mark | 1151 | 813 |
| PassMark - CPU mark | 2275 | 1027 |
| Geekbench 4 - Single Core | 491 | 317 |
| Geekbench 4 - Multi-Core | 1112 | 689 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.434 | 1.641 |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 23.365 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.153 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.75 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 1.755 | |
| GFXBench 4.0 - Car Chase Offscreen (Frames) | 1127 | |
| GFXBench 4.0 - Manhattan (Frames) | 3296 | |
| GFXBench 4.0 - T-Rex (Frames) | 5755 | |
| GFXBench 4.0 - Car Chase Offscreen (Fps) | 1127 | |
| GFXBench 4.0 - Manhattan (Fps) | 3296 | |
| GFXBench 4.0 - T-Rex (Fps) | 5755 |
Compare specifications (specs)
| Intel Core i3-6006U | Intel Core i3-330M | |
|---|---|---|
Essentials |
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| Architecture codename | Skylake | Arrandale |
| Launch date | 11 November 2016 | 10 January 2010 |
| Launch price (MSRP) | $281 | $49 |
| Place in performance rating | 1646 | 2972 |
| Processor Number | i3-6006U | i3-330M |
| Series | 6th Generation Intel® Core™ i3 Processors | Legacy Intel® Core™ Processors |
| Status | Launched | Discontinued |
| Vertical segment | Mobile | Mobile |
| Price now | $48.56 | |
| Value for money (0-100) | 10.85 | |
Performance |
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| 64 bit support | ||
| Base frequency | 2.00 GHz | 2.13 GHz |
| Bus Speed | 4 GT/s OPI | 2.5 GT/s DMI |
| Die size | 99 mm | 81 mm2 |
| L1 cache | 128 KB | |
| L2 cache | 512 KB | 512 KB |
| L3 cache | 3 MB | 3072 KB |
| Manufacturing process technology | 14 nm | 32 nm |
| Maximum core temperature | 100°C | 90°C for rPGA, 105°C for BGA |
| Maximum frequency | 2 GHz | 2.13 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 4 |
| Front-side bus (FSB) | 2500 MHz | |
| Transistor count | 382 million | |
Memory |
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| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 34.1 GB/s | 17.1 GB/s |
| Maximum memory size | 32 GB | 8 GB |
| Supported memory types | DDR4-2133, LPDDR3-1866, DDR3L-1600 | DDR3 800/1066 |
Graphics |
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| Device ID | 0x1916 | |
| Graphics base frequency | 300 MHz | 500 MHz |
| Graphics max dynamic frequency | 900 MHz | 667 MHz |
| Graphics max frequency | 900 MHz | 667 MHz |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 32 GB | |
| Processor graphics | Intel® HD Graphics 520 | Intel HD Graphics |
| Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
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| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | 2 |
| Wireless Display (WiDi) support | ||
Graphics image quality |
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| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2304@60Hz | |
| Max resolution over eDP | 4096x2304@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
| Max resolution over WiDi | 1080p | |
Graphics API support |
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| DirectX | 12 | |
| OpenGL | 4.5 | |
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 42mm X 24mm | rPGA 37.5mmx 37.5mm, BGA 34mmx28mm |
| Sockets supported | FCBGA1356 | BGA1288, PGA988 |
| Thermal Design Power (TDP) | 15 Watt | 35 Watt |
Peripherals |
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| Max number of PCIe lanes | 12 | 16 |
| PCI Express revision | 3.0 | 2.0 |
| PCIe configurations | 1x4, 2x2, 1x2+2x1 and 4x1 | 1x16 |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® SSE4.1, Intel® SSE4.2 |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Smart Response technology | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Speed Shift technology | ||
| Thermal Monitoring | ||
| Flexible Display interface (FDI) | ||
| Intel® Fast Memory Access | ||
| Physical Address Extensions (PAE) | 36-bit | |
Virtualization |
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| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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