Intel Core i3-6102E vs Intel Celeron M P4500
Comparative analysis of Intel Core i3-6102E and Intel Celeron M P4500 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-6102E
- 2 more threads: 4 vs 2
- Around 11% higher maximum core temperature: 100°C vs 90°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
- 8x more maximum memory size: 64 GB vs 8 GB
- Around 40% lower typical power consumption: 25 Watt vs 35 Watt
- Around 43% better performance in PassMark - Single thread mark: 1068 vs 747
- 2.8x better performance in PassMark - CPU mark: 2349 vs 848
Specifications (specs) | |
Number of threads | 4 vs 2 |
Maximum core temperature | 100°C vs 90°C |
Manufacturing process technology | 14 nm vs 32 nm |
Maximum memory size | 64 GB vs 8 GB |
Thermal Design Power (TDP) | 25 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 1068 vs 747 |
PassMark - CPU mark | 2349 vs 848 |
Compare benchmarks
CPU 1: Intel Core i3-6102E
CPU 2: Intel Celeron M P4500
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-6102E | Intel Celeron M P4500 |
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PassMark - Single thread mark | 1068 | 747 |
PassMark - CPU mark | 2349 | 848 |
Geekbench 4 - Single Core | 1322 | |
Geekbench 4 - Multi-Core | 2271 |
Compare specifications (specs)
Intel Core i3-6102E | Intel Celeron M P4500 | |
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Essentials |
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Architecture codename | Skylake | Arrandale |
Launch date | Q4'15 | 1 April 2010 |
Place in performance rating | 2170 | 2174 |
Processor Number | i3-6102E | P4500 |
Series | 6th Generation Intel® Core™ i3 Processors | Legacy Intel® Celeron® Processor |
Status | Launched | Launched |
Vertical segment | Embedded | Mobile |
Launch price (MSRP) | $86 | |
Performance |
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64 bit support | ||
Base frequency | 1.90 GHz | 1.86 GHz |
Bus Speed | 8 GT/s DMI3 | 2.5 GT/s DMI |
Manufacturing process technology | 14 nm | 32 nm |
Maximum core temperature | 100°C | 90°C |
Number of cores | 2 | 2 |
Number of threads | 4 | 2 |
Die size | 81 mm2 | |
Front-side bus (FSB) | 2500 MHz | |
L1 cache | 128 KB | |
L2 cache | 512 KB | |
L3 cache | 2 MB | |
Maximum frequency | 1.86 GHz | |
Transistor count | 382 million | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 34.1 GB/s | 17.1 GB/s |
Maximum memory size | 64 GB | 8 GB |
Supported memory types | DDR4-2133, LPDDR3-1866, DDR3L-1600 | DDR3 800/1066 |
Graphics |
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Device ID | 0x191B | |
Graphics base frequency | 350 MHz | 500 MHz |
Graphics max dynamic frequency | 950 MHz | 667 MHz |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel® HD Graphics 530 | Intel HD Graphics |
Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 2 |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 42mm x 28mm | 37.5mmx37.5mm |
Sockets supported | FCBGA1440 | PGA988 |
Thermal Design Power (TDP) | 25 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 3.0 | 2.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | 1x16 |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Physical Address Extensions (PAE) | 36-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |