Intel Core i3-7101TE vs Intel Xeon W-3175X

Comparative analysis of Intel Core i3-7101TE and Intel Xeon W-3175X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

Intel Core i3-7101TE

Intel Xeon W-3175X

Differences

Reasons to consider the Intel Core i3-7101TE

Around 4% higher maximum core temperature: 88°C vs 85°C
7.3x lower typical power consumption: 35 Watt vs 255 Watt
3.6x better performance in Geekbench 4 - Single Core: 4096 vs 1136

Specifications (specs)
Maximum core temperature	88°C vs 85°C
Thermal Design Power (TDP)	35 Watt vs 255 Watt
Benchmarks
Geekbench 4 - Single Core	4096 vs 1136

Reasons to consider the Intel Xeon W-3175X

Processor is unlocked, an unlocked multiplier allows for easier overclocking
26 more cores, run more applications at once: 28 vs 2
52 more threads: 56 vs 4
8x more maximum memory size: 512 GB vs 64 GB
Around 20% better performance in PassMark - Single thread mark: 2419 vs 2020
11.1x better performance in PassMark - CPU mark: 43850 vs 3957
2.9x better performance in Geekbench 4 - Multi-Core: 23343 vs 8070

Specifications (specs)
Unlocked	Unlocked vs Locked
Number of cores	28 vs 2
Number of threads	56 vs 4
Maximum memory size	512 GB vs 64 GB
Benchmarks
PassMark - Single thread mark	2419 vs 2020
PassMark - CPU mark	43850 vs 3957
Geekbench 4 - Multi-Core	23343 vs 8070

Compare benchmarks

CPU 1: Intel Core i3-7101TE
CPU 2: Intel Xeon W-3175X

PassMark - Single thread mark

CPU 1

CPU 2

2020

2419

PassMark - CPU mark

CPU 1

CPU 2

3957

43850

Geekbench 4 - Single Core

CPU 1

CPU 2

4096

1136

Geekbench 4 - Multi-Core

CPU 1

CPU 2

8070

23343

Name	Intel Core i3-7101TE	Intel Xeon W-3175X
PassMark - Single thread mark	2020	2419
PassMark - CPU mark	3957	43850
Geekbench 4 - Single Core	4096	1136
Geekbench 4 - Multi-Core	8070	23343
GFXBench 4.0 - Car Chase Offscreen (Frames)	1854
GFXBench 4.0 - Manhattan (Frames)	4298
GFXBench 4.0 - T-Rex (Frames)	6772
GFXBench 4.0 - Car Chase Offscreen (Fps)	1854
GFXBench 4.0 - Manhattan (Fps)	4298
GFXBench 4.0 - T-Rex (Fps)	6772

Compare specifications (specs)

	Intel Core i3-7101TE	Intel Xeon W-3175X
Essentials
Architecture codename	Kaby Lake	Skylake
Launch date	Q1'17	October 2018
Place in performance rating	423	436
Processor Number	i3-7101TE	W-3175X
Series	7th Generation Intel® Core™ i3 Processors	Intel® Xeon® W Processor
Status	Launched	Launched
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.40 GHz	3.10 GHz
Bus Speed	8 GT/s DMI3	8 GT/s DMI3
Manufacturing process technology	14 nm	14 nm
Maximum core temperature	88°C	85°C
Number of cores	2	28
Number of threads	4	56
L1 cache		64K (per core)
L2 cache		1 MB (per core)
L3 cache		38.5 MB (shared)
Maximum frequency		3.80 GHz
Number of Ultra Path Interconnect (UPI) Links		0
Transistor count		8000 million
Unlocked
Memory
Max memory channels	2	6
Maximum memory bandwidth	34.1 GB/s
Maximum memory size	64 GB	512 GB
Supported memory types	DDR3L-1600, DDR4-2400	DDR4-2666
Supported memory frequency		2666 MHz
Graphics
Device ID	0x5902
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.10 GHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	64 GB
Processor graphics	Intel® HD Graphics 630
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3
Graphics image quality
4K resolution support
Max resolution over DisplayPort	4096x2304@60Hz
Max resolution over eDP	4096x2304@60Hz
Max resolution over HDMI 1.4	4096x2304@30Hz
Graphics API support
DirectX	12
OpenGL	4.5
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	76.0mm x 56.5mm
Sockets supported	FCLGA1151	FCLGA3647
Thermal Design Power (TDP)	35 Watt	255 Watt
Peripherals
Max number of PCIe lanes	16	48
PCI Express revision	3.0	3.0
PCIe configurations	1x16,2x8,1x8+2x4
Scalability	1S Only	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Intel® Advanced Vector Extensions (AVX)
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units		2
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)