Intel Core i3-9100F vs Intel Core i7-870

Comparative analysis of Intel Core i3-9100F and Intel Core i7-870 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the Intel Core i3-9100F

  • CPU is newer: launch date 9 year(s) 7 month(s) later
  • Around 17% higher clock speed: 4.20 GHz vs 3.60 GHz
  • Around 38% higher maximum core temperature: 100 °C vs 72.7°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
  • 4x more maximum memory size: 64 GB vs 16 GB
  • Around 46% lower typical power consumption: 65 Watt vs 95 Watt
  • Around 80% better performance in PassMark - Single thread mark: 2490 vs 1385
  • 2.1x better performance in PassMark - CPU mark: 6719 vs 3160
  • Around 97% better performance in Geekbench 4 - Single Core: 1078 vs 547
  • Around 67% better performance in Geekbench 4 - Multi-Core: 3394 vs 2032
  • Around 4% better performance in 3DMark Fire Strike - Physics Score: 2548 vs 2453
Specifications (specs)
Launch date 23 April 2019 vs September 2009
Maximum frequency 4.20 GHz vs 3.60 GHz
Maximum core temperature 100 °C vs 72.7°C
Manufacturing process technology 14 nm vs 45 nm
Maximum memory size 64 GB vs 16 GB
Thermal Design Power (TDP) 65 Watt vs 95 Watt
Benchmarks
PassMark - Single thread mark 2490 vs 1385
PassMark - CPU mark 6719 vs 3160
Geekbench 4 - Single Core 1078 vs 547
Geekbench 4 - Multi-Core 3394 vs 2032
3DMark Fire Strike - Physics Score 2548 vs 2453

Reasons to consider the Intel Core i7-870

  • 4 more threads: 8 vs 4
Number of threads 8 vs 4

Compare benchmarks

CPU 1: Intel Core i3-9100F
CPU 2: Intel Core i7-870

PassMark - Single thread mark
CPU 1
CPU 2
2490
1385
PassMark - CPU mark
CPU 1
CPU 2
6719
3160
Geekbench 4 - Single Core
CPU 1
CPU 2
1078
547
Geekbench 4 - Multi-Core
CPU 1
CPU 2
3394
2032
3DMark Fire Strike - Physics Score
CPU 1
CPU 2
2548
2453
Name Intel Core i3-9100F Intel Core i7-870
PassMark - Single thread mark 2490 1385
PassMark - CPU mark 6719 3160
Geekbench 4 - Single Core 1078 547
Geekbench 4 - Multi-Core 3394 2032
3DMark Fire Strike - Physics Score 2548 2453
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 1.029
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 53.478
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.342
CompuBench 1.5 Desktop - Video Composition (Frames/s) 1.541
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 4.602

Compare specifications (specs)

Intel Core i3-9100F Intel Core i7-870

Essentials

Architecture codename Coffee Lake Lynnfield
Launch date 23 April 2019 September 2009
Launch price (MSRP) $389 $197
Place in performance rating 1479 2680
Processor Number i3-9100F i7-870
Vertical segment Desktop Desktop
Price now $98.99
Series Legacy Intel® Core™ Processors
Status Discontinued
Value for money (0-100) 15.90

Performance

64 bit support
Base frequency 3.60 GHz 2.93 GHz
Bus Speed 8 GT/s DMI 2.5 GT/s DMI
Manufacturing process technology 14 nm 45 nm
Maximum core temperature 100 °C 72.7°C
Maximum frequency 4.20 GHz 3.60 GHz
Number of cores 4 4
Number of threads 4 8
Unlocked
Die size 296 mm2
L1 cache 64 KB (per core)
L2 cache 256 KB (per core)
L3 cache 8192 KB (shared)
Transistor count 774 million
VID voltage range 0.6500V-1.4000V

Memory

ECC memory support
Max memory channels 2 2
Maximum memory bandwidth 37.5 GB/s 21 GB/s
Maximum memory size 64 GB 16 GB
Supported memory types DDR4-2400 DDR3 1066/1333

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported FCLGA1151 LGA1156
Thermal Design Power (TDP) 65 Watt 95 Watt
Low Halogen Options Available
Package Size 37.5mm x 37.5mm

Peripherals

Max number of PCIe lanes 16 16
PCI Express revision 3.0 2.0
PCIe configurations 1x16, 2x8, 1x8+2x4 1x16, 2x8

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel SSE4.1, Intel SSE4.2, Intel AVX2 Intel® SSE4.2
Integrated Intel® QuickAssist Technology
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Intel 64
Intel® Demand Based Switching
Physical Address Extensions (PAE) 36-bit

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)