Intel Core i7-870 processor review
Core i7-870 processor released by Intel; release date: September 2009. At the time of release, the processor cost $197. The processor is designed for desktop-computers and based on Lynnfield microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 4, threads - 8. Maximum CPU clock speed - 3.60 GHz. Maximum operating temperature - 72.7°C. Manufacturing process technology - 45 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 8192 KB (shared).
Supported memory types: DDR3 1066/1333. Maximum memory size: 16 GB.
Supported socket types: LGA1156. Maximum number of processors in a configuration - 1. Power consumption (TDP): 95 Watt.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Geekbench 4 Single Core |
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| Geekbench 4 Multi-Core |
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| 3DMark Fire Strike Physics Score |
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| CompuBench 1.5 Desktop Face Detection |
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| CompuBench 1.5 Desktop Ocean Surface Simulation |
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| CompuBench 1.5 Desktop T-Rex |
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| CompuBench 1.5 Desktop Video Composition |
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| CompuBench 1.5 Desktop Bitcoin Mining |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 1384 |
| PassMark - CPU mark | 3140 |
| Geekbench 4 - Single Core | 547 |
| Geekbench 4 - Multi-Core | 2032 |
| 3DMark Fire Strike - Physics Score | 2453 |
| CompuBench 1.5 Desktop - Face Detection | 1.029 mPixels/s |
| CompuBench 1.5 Desktop - Ocean Surface Simulation | 53.478 Frames/s |
| CompuBench 1.5 Desktop - T-Rex | 0.342 Frames/s |
| CompuBench 1.5 Desktop - Video Composition | 1.541 Frames/s |
| CompuBench 1.5 Desktop - Bitcoin Mining | 4.602 mHash/s |
Specifications (specs)
Essentials |
|
| Architecture codename | Lynnfield |
| Launch date | September 2009 |
| Launch price (MSRP) | $197 |
| Place in performance rating | 2671 |
| Price now | $98.99 |
| Processor Number | i7-870 |
| Series | Legacy Intel® Core™ Processors |
| Status | Discontinued |
| Value for money (0-100) | 15.90 |
| Vertical segment | Desktop |
Performance |
|
| 64 bit support | |
| Base frequency | 2.93 GHz |
| Bus Speed | 2.5 GT/s DMI |
| Die size | 296 mm2 |
| L1 cache | 64 KB (per core) |
| L2 cache | 256 KB (per core) |
| L3 cache | 8192 KB (shared) |
| Manufacturing process technology | 45 nm |
| Maximum core temperature | 72.7°C |
| Maximum frequency | 3.60 GHz |
| Number of cores | 4 |
| Number of threads | 8 |
| Transistor count | 774 million |
| VID voltage range | 0.6500V-1.4000V |
Memory |
|
| Max memory channels | 2 |
| Maximum memory bandwidth | 21 GB/s |
| Maximum memory size | 16 GB |
| Supported memory types | DDR3 1066/1333 |
Compatibility |
|
| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 1 |
| Package Size | 37.5mm x 37.5mm |
| Sockets supported | LGA1156 |
| Thermal Design Power (TDP) | 95 Watt |
Peripherals |
|
| Max number of PCIe lanes | 16 |
| PCI Express revision | 2.0 |
| PCIe configurations | 1x16, 2x8 |
Security & Reliability |
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| Execute Disable Bit (EDB) | |
| Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | |
| Idle States | |
| Instruction set extensions | Intel® SSE4.2 |
| Intel 64 | |
| Intel® AES New Instructions | |
| Intel® Demand Based Switching | |
| Intel® Hyper-Threading technology | |
| Intel® Turbo Boost technology | |
| Intel® vPro™ Platform Eligibility | |
| Physical Address Extensions (PAE) | 36-bit |
| Thermal Monitoring | |
Virtualization |
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| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
| Intel® VT-x with Extended Page Tables (EPT) | |
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