Intel Core i5-520E vs Intel Core i3-330E
Comparative analysis of Intel Core i5-520E and Intel Core i3-330E processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i5-520E
- Around 17% higher maximum core temperature: 105°C vs 90°C for rPGA,105°C for BGA
Maximum core temperature | 105°C vs 90°C for rPGA,105°C for BGA |
Compare benchmarks
CPU 1: Intel Core i5-520E
CPU 2: Intel Core i3-330E
Name | Intel Core i5-520E | Intel Core i3-330E |
---|---|---|
PassMark - Single thread mark | 934 | |
PassMark - CPU mark | 1260 |
Compare specifications (specs)
Intel Core i5-520E | Intel Core i3-330E | |
---|---|---|
Essentials |
||
Architecture codename | Arrandale | Arrandale |
Launch date | Q1'10 | Q1'10 |
Place in performance rating | not rated | 2353 |
Processor Number | i5-520E | i3-330E |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Launched | Launched |
Vertical segment | Embedded | Mobile |
Performance |
||
64 bit support | ||
Base frequency | 2.40 GHz | 2.13 GHz |
Bus Speed | 2.5 GT/s DMI | 2.5 GT/s DMI |
Die size | 81 mm2 | 81 mm2 |
Manufacturing process technology | 32 nm | 32 nm |
Maximum core temperature | 105°C | 90°C for rPGA,105°C for BGA |
Maximum frequency | 2.93 GHz | |
Number of cores | 2 | 2 |
Number of threads | 4 | 4 |
Transistor count | 382 million | 382 million |
Memory |
||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 17.1 GB/s | 17.1 GB/s |
Maximum memory size | 8.79 GB | 8.79 GB |
Supported memory types | DDR3 800/1066 | DDR3 800/1066 |
Graphics |
||
Graphics base frequency | 500 MHz | 500 MHz |
Graphics max dynamic frequency | 766 MHz | 667 MHz |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
||
Number of displays supported | 2 | 2 |
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | BGA 34mmX28mm | BGA 34mmX28mm |
Sockets supported | BGA1288 | BGA1288 |
Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Peripherals |
||
Max number of PCIe lanes | 1 | 16 |
PCI Express revision | 2.0 | 2.0 |
PCIe configurations | 1X16, 2X8 | 1X16, 2X8 |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | 36-bit |
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |