Architecture codename |
Amber Lake Y |
Haswell |
Launch date |
30 August 2018 |
1 September 2013 |
Place in performance rating |
1032 |
1040 |
Processor Number |
i5-8200Y |
i7-4610Y |
Series |
8th Generation Intel® Core™ i5 Processors |
4th Generation Intel® Core™ i7 Processors |
Status |
Launched |
Launched |
Vertical segment |
Mobile |
Mobile |
Launch price (MSRP) |
|
$415 |
64 bit support |
|
|
Base frequency |
1.30 GHz |
1.70 GHz |
Bus Speed |
4 GT/s OPI |
5 GT/s DMI2 |
L1 cache |
128 KB |
128 KB |
L2 cache |
512 KB |
512 KB |
L3 cache |
4 MB |
4 MB |
Manufacturing process technology |
14 nm |
22 nm |
Maximum core temperature |
100°C |
100°C |
Maximum frequency |
3.90 GHz |
2.90 GHz |
Number of cores |
2 |
2 |
Number of threads |
4 |
4 |
Max memory channels |
2 |
2 |
Maximum memory bandwidth |
29.8 GB/s |
25.6 GB/s |
Maximum memory size |
16 GB |
16 GB |
Supported memory types |
LPDDR3-1866, DDR3L-1600 |
DDR3L 1333/1600, LPDDR3 1333/1600 |
Device ID |
0x591C |
0x402 |
Graphics base frequency |
300 MHz |
200 MHz |
Graphics max dynamic frequency |
950 MHz |
850 MHz |
Intel® Clear Video HD technology |
|
|
Intel® Clear Video technology |
|
|
Intel® Quick Sync Video |
|
|
Max video memory |
16 GB |
2 GB |
Processor graphics |
Intel® UHD Graphics 615 |
Intel® HD Graphics 4200 |
Graphics max frequency |
|
850 MHz |
Intel® Flexible Display Interface (Intel® FDI) |
|
|
Intel® InTru™ 3D technology |
|
|
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Number of displays supported |
3 |
3 |
VGA |
|
|
Wireless Display (WiDi) support |
|
|
4K resolution support |
|
|
Max resolution over DisplayPort |
3840x2160@60Hz |
2560x1600@60Hz |
Max resolution over eDP |
3840x2160@60Hz |
|
Max resolution over HDMI 1.4 |
4096x2304@24Hz |
2560x1600@60Hz |
Max resolution over VGA |
|
N / A |
DirectX |
12 |
11.2/12 |
OpenGL |
4.5 |
4.3 |
Configurable TDP-down |
3.5 W |
|
Configurable TDP-down Frequency |
600 MHz |
|
Configurable TDP-up |
7 W |
|
Configurable TDP-up Frequency |
1.60 GHz |
|
Low Halogen Options Available |
|
|
Max number of CPUs in a configuration |
1 |
1 |
Package Size |
20mm X 16.5mm |
40mm x 24mm x 1.5mm |
Sockets supported |
FCBGA1515 |
FCBGA1168 |
Thermal Design Power (TDP) |
5 Watt |
11.5 Watt |
Scenario Design Power (SDP) |
|
6 W |
Max number of PCIe lanes |
10 |
12 |
PCI Express revision |
3.0 |
2.0 |
PCIe configurations |
1x4, 2x2, 1x2+2x1 and 4x1 |
4x1, 2x4 |
Integrated IDE |
|
|
Integrated LAN |
|
|
Max number of SATA 6 Gb/s Ports |
|
4 |
Number of USB ports |
|
4 |
PCI support |
|
|
Total number of SATA ports |
|
4 |
UART |
|
|
USB revision |
|
3.0 |
Execute Disable Bit (EDB) |
|
|
Intel® Identity Protection technology |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Intel® Secure Key technology |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Intel® Trusted Execution technology (TXT) |
|
|
Anti-Theft technology |
|
|
Enhanced Intel SpeedStep® technology |
|
|
Idle States |
|
|
Instruction set extensions |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® AES New Instructions |
|
|
Intel® Flex Memory Access |
|
|
Intel® Hyper-Threading technology |
|
|
Intel® My WiFi technology |
|
|
Intel® Smart Response technology |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® TSX-NI |
|
|
Intel® Turbo Boost technology |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
Flexible Display interface (FDI) |
|
|
General-Purpose Input/Output (GPIO) |
|
|
HD Audio |
|
|
Intel® Active Management technology (AMT) |
|
|
Intel® ME Firmware Version |
|
9.5 |
Intel® Rapid Storage technology (RST) |
|
|
Smart Connect |
|
|
AMD Virtualization (AMD-V™) |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|