Intel Core i7-2610UE vs AMD Phenom II X3 P840

Comparative analysis of Intel Core i7-2610UE and AMD Phenom II X3 P840 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core i7-2610UE

AMD Phenom II X3 P840

Differences

Reasons to consider the Intel Core i7-2610UE

1 more threads: 4 vs 3
Around 26% higher clock speed: 2.40 GHz vs 1.9 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
Around 47% lower typical power consumption: 17 Watt vs 25 Watt
Around 38% better performance in PassMark - Single thread mark: 1051 vs 760
Around 42% better performance in PassMark - CPU mark: 1527 vs 1079

Specifications (specs)
Number of threads	4 vs 3
Maximum frequency	2.40 GHz vs 1.9 GHz
Manufacturing process technology	32 nm vs 45 nm
Thermal Design Power (TDP)	17 Watt vs 25 Watt
Benchmarks
PassMark - Single thread mark	1051 vs 760
PassMark - CPU mark	1527 vs 1079

Reasons to consider the AMD Phenom II X3 P840

1 more cores, run more applications at once: 3 vs 2

Number of cores	3 vs 2

Compare benchmarks

CPU 1: Intel Core i7-2610UE
CPU 2: AMD Phenom II X3 P840

PassMark - Single thread mark

CPU 1

CPU 2

1051

760

PassMark - CPU mark

CPU 1

CPU 2

1527

1079

Name	Intel Core i7-2610UE	AMD Phenom II X3 P840
PassMark - Single thread mark	1051	760
PassMark - CPU mark	1527	1079
Geekbench 4 - Single Core		1164
Geekbench 4 - Multi-Core		2663

Compare specifications (specs)

	Intel Core i7-2610UE	AMD Phenom II X3 P840
Essentials
Architecture codename	Sandy Bridge	Champlain
Launch date	Q1'11	4 October 2010
Place in performance rating	2216	2208
Processor Number	i7-2610UE
Series	Legacy Intel® Core™ Processors	3x AMD Phenom II
Status	Launched
Vertical segment	Embedded	Laptop
Performance
64 bit support
Base frequency	1.50 GHz
Bus Speed	5 GT/s DMI
Manufacturing process technology	32 nm	45 nm
Maximum core temperature	100 C
Maximum frequency	2.40 GHz	1.9 GHz
Number of cores	2	3
Number of threads	4	3
Front-side bus (FSB)		3600 MHz
L1 cache		384 KB
L2 cache		1.5 MB
Memory
Max memory channels	2
Maximum memory size	16.6 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	850 MHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel® HD Graphics 3000
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Compatibility
Low Halogen Options Available
Package Size	31mm x 24mm (FCBGA1023)
Sockets supported	FCBGA1023	S1
Thermal Design Power (TDP)	17 Watt	25 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8+2x4
Security & Reliability
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
VirusProtect
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)