Intel Core i7-2610UE vs Intel Core 2 Duo P7370

Comparative analysis of Intel Core i7-2610UE and Intel Core 2 Duo P7370 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core i7-2610UE

Intel Core 2 Duo P7370

Differences

Reasons to consider the Intel Core i7-2610UE

2 more threads: 4 vs 2
Around 20% higher clock speed: 2.40 GHz vs 2 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
Around 47% lower typical power consumption: 17 Watt vs 25 Watt
Around 33% better performance in PassMark - Single thread mark: 1051 vs 793
Around 93% better performance in PassMark - CPU mark: 1527 vs 790

Specifications (specs)
Number of threads	4 vs 2
Maximum frequency	2.40 GHz vs 2 GHz
Manufacturing process technology	32 nm vs 45 nm
Thermal Design Power (TDP)	17 Watt vs 25 Watt
Benchmarks
PassMark - Single thread mark	1051 vs 793
PassMark - CPU mark	1527 vs 790

Compare benchmarks

CPU 1: Intel Core i7-2610UE
CPU 2: Intel Core 2 Duo P7370

PassMark - Single thread mark

CPU 1

CPU 2

1051

793

PassMark - CPU mark

CPU 1

CPU 2

1527

790

Name	Intel Core i7-2610UE	Intel Core 2 Duo P7370
PassMark - Single thread mark	1051	793
PassMark - CPU mark	1527	790
Geekbench 4 - Single Core		1249
Geekbench 4 - Multi-Core		1856

Compare specifications (specs)

	Intel Core i7-2610UE	Intel Core 2 Duo P7370
Essentials
Architecture codename	Sandy Bridge	Penryn
Launch date	Q1'11	1 January 2009
Place in performance rating	2220	2229
Processor Number	i7-2610UE	P7370
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Launched	Discontinued
Vertical segment	Embedded	Mobile
Performance
64 bit support
Base frequency	1.50 GHz	2.00 GHz
Bus Speed	5 GT/s DMI	1066 MHz FSB
Manufacturing process technology	32 nm	45 nm
Maximum core temperature	100 C
Maximum frequency	2.40 GHz	2 GHz
Number of cores	2	2
Number of threads	4	2
Die size		107 mm2
Front-side bus (FSB)		1066 MHz
L2 cache		3072 KB
Transistor count		410 million
VID voltage range		1.00V-1.25V
Memory
Max memory channels	2
Maximum memory size	16.6 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	850 MHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel® HD Graphics 3000
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Compatibility
Low Halogen Options Available
Package Size	31mm x 24mm (FCBGA1023)	35mm x 35mm
Sockets supported	FCBGA1023	PGA478
Thermal Design Power (TDP)	17 Watt	25 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8+2x4
Security & Reliability
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Execute Disable Bit (EDB)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)