Intel Core i7-2655LE vs AMD Phenom II X4 N950

Comparative analysis of Intel Core i7-2655LE and AMD Phenom II X4 N950 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core i7-2655LE

  • Around 38% higher clock speed: 2.90 GHz vs 2.1 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
  • Around 40% lower typical power consumption: 25 Watt vs 35 Watt
  • Around 43% better performance in PassMark - Single thread mark: 1231 vs 859
  • Around 26% better performance in PassMark - CPU mark: 1999 vs 1587
Specifications (specs)
Maximum frequency 2.90 GHz vs 2.1 GHz
Manufacturing process technology 32 nm vs 45 nm
Thermal Design Power (TDP) 25 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark 1231 vs 859
PassMark - CPU mark 1999 vs 1587

Reasons to consider the AMD Phenom II X4 N950

  • 2 more cores, run more applications at once: 4 vs 2
Number of cores 4 vs 2

Compare benchmarks

CPU 1: Intel Core i7-2655LE
CPU 2: AMD Phenom II X4 N950

PassMark - Single thread mark
CPU 1
CPU 2
1231
859
PassMark - CPU mark
CPU 1
CPU 2
1999
1587
Name Intel Core i7-2655LE AMD Phenom II X4 N950
PassMark - Single thread mark 1231 859
PassMark - CPU mark 1999 1587
Geekbench 4 - Single Core 1316
Geekbench 4 - Multi-Core 3852

Compare specifications (specs)

Intel Core i7-2655LE AMD Phenom II X4 N950

Essentials

Architecture codename Sandy Bridge Champlain
Launch date Q1'11 4 October 2010
Place in performance rating 1997 1983
Processor Number i7-2655LE
Series Legacy Intel® Core™ Processors 4x AMD Phenom II
Status Launched
Vertical segment Embedded Laptop

Performance

64 bit support
Base frequency 2.20 GHz
Bus Speed 5 GT/s DMI
Manufacturing process technology 32 nm 45 nm
Maximum core temperature 100 C
Maximum frequency 2.90 GHz 2.1 GHz
Number of cores 2 4
Number of threads 4 4
Front-side bus (FSB) 3600 MHz
L1 cache 512 KB
L2 cache 2048 KB

Memory

Max memory channels 2
Maximum memory size 16.6 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 650 MHz
Graphics max dynamic frequency 1.00 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 3000

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO

Compatibility

Low Halogen Options Available
Package Size 31mm x 24mm (FCBGA1023)
Sockets supported FCBGA1023 S1
Thermal Design Power (TDP) 25 Watt 35 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8+2x4

Security & Reliability

Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)