Intel Core i7-5960X vs AMD Phenom II X3 B75
Comparative analysis of Intel Core i7-5960X and AMD Phenom II X3 B75 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i7-5960X
- CPU is newer: launch date 4 year(s) 11 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 5 more cores, run more applications at once: 8 vs 3
- 13 more threads: 16 vs 3
- Around 17% higher clock speed: 3.50 GHz vs 3 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- Around 33% more L2 cache; more data can be stored in the L2 cache for quick access later
- 3.3x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 58% better performance in PassMark - Single thread mark: 1987 vs 1256
- 7.2x better performance in PassMark - CPU mark: 12744 vs 1781
- Around 78% better performance in Geekbench 4 - Multi-Core: 7886 vs 4439
Specifications (specs) | |
Launch date | 1 September 2014 vs October 2009 |
Unlocked | Unlocked vs Locked |
Number of cores | 8 vs 3 |
Number of threads | 16 vs 3 |
Maximum frequency | 3.50 GHz vs 3 GHz |
Manufacturing process technology | 22 nm vs 45 nm |
L2 cache | 2 MB vs 512 KB (per core) |
L3 cache | 20 MB vs 6144 KB (shared) |
Benchmarks | |
PassMark - Single thread mark | 1987 vs 1256 |
PassMark - CPU mark | 12744 vs 1781 |
Geekbench 4 - Multi-Core | 7886 vs 4439 |
Reasons to consider the AMD Phenom II X3 B75
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 47% lower typical power consumption: 95 Watt vs 140 Watt
- Around 91% better performance in Geekbench 4 - Single Core: 1905 vs 1000
Specifications (specs) | |
L1 cache | 128 KB (per core) vs 256 KB |
Thermal Design Power (TDP) | 95 Watt vs 140 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 1905 vs 1000 |
Compare benchmarks
CPU 1: Intel Core i7-5960X
CPU 2: AMD Phenom II X3 B75
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core i7-5960X | AMD Phenom II X3 B75 |
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PassMark - Single thread mark | 1987 | 1256 |
PassMark - CPU mark | 12744 | 1781 |
Geekbench 4 - Single Core | 1000 | 1905 |
Geekbench 4 - Multi-Core | 7886 | 4439 |
3DMark Fire Strike - Physics Score | 5203 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 10.511 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 196.307 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 1.218 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 5.467 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 14.265 |
Compare specifications (specs)
Intel Core i7-5960X | AMD Phenom II X3 B75 | |
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Essentials |
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Architecture codename | Haswell E | Heka |
Launch date | 1 September 2014 | October 2009 |
Launch price (MSRP) | $999 | |
Place in performance rating | 1477 | 1503 |
Price now | $768.99 | $39.99 |
Processor Number | i7-5960X | |
Series | Intel® Core™ X-series Processors | AMD Business Class - AMD Phenom X3 Triple-Core |
Status | Discontinued | |
Value for money (0-100) | 6.11 | 21.61 |
Vertical segment | Desktop | Desktop |
Family | AMD Phenom | |
OPN Tray | HDXB75WFK3DGM | |
Performance |
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64 bit support | ||
Base frequency | 3.00 GHz | 3 GHz |
Bus Speed | 0 GT/s | |
Die size | 356 mm | 258 mm |
L1 cache | 256 KB | 128 KB (per core) |
L2 cache | 2 MB | 512 KB (per core) |
L3 cache | 20 MB | 6144 KB (shared) |
Manufacturing process technology | 22 nm | 45 nm |
Maximum core temperature | 66.8 °C | |
Maximum frequency | 3.50 GHz | 3 GHz |
Number of cores | 8 | 3 |
Number of threads | 16 | 3 |
Transistor count | 2600 million | 758 million |
Unlocked | ||
Memory |
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Max memory channels | 4 | |
Maximum memory bandwidth | 68 GB/s | |
Maximum memory size | 64 GB | |
Supported memory types | DDR4 1600/1866/2133 | DDR3 |
Graphics |
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Processor graphics | None | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 52.5mm x 45.0mm | |
Sockets supported | FCLGA2011-3 | AM3 |
Thermal Design Power (TDP) | 140 Watt | 95 Watt |
Peripherals |
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Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Smart Response technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |