Intel Core i7-6900K vs AMD Phenom II X2 570 BE
Comparative analysis of Intel Core i7-6900K and AMD Phenom II X2 570 BE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i7-6900K
- CPU is newer: launch date 6 year(s) 0 month(s) later
- 6 more cores, run more applications at once: 8 vs 2
- Around 6% higher clock speed: 3.70 GHz vs 3.5 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 3.3x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 65% better performance in PassMark - Single thread mark: 2329 vs 1412
- 10.4x better performance in PassMark - CPU mark: 14476 vs 1395
- 2.2x better performance in Geekbench 4 - Multi-Core: 7893 vs 3615
Specifications (specs) | |
Launch date | May 2016 vs May 2010 |
Number of cores | 8 vs 2 |
Maximum frequency | 3.70 GHz vs 3.5 GHz |
Manufacturing process technology | 14 nm vs 45 nm |
L2 cache | 256 KB (per core) vs 512 KB (per core) |
L3 cache | 20480 KB (shared) vs 6144 KB (shared) |
Benchmarks | |
PassMark - Single thread mark | 2329 vs 1412 |
PassMark - CPU mark | 14476 vs 1395 |
Geekbench 4 - Multi-Core | 7893 vs 3615 |
Reasons to consider the AMD Phenom II X2 570 BE
- Around 75% lower typical power consumption: 80 Watt vs 140 Watt
- 2.1x better performance in Geekbench 4 - Single Core: 2107 vs 1005
Specifications (specs) | |
Thermal Design Power (TDP) | 80 Watt vs 140 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 2107 vs 1005 |
Compare benchmarks
CPU 1: Intel Core i7-6900K
CPU 2: AMD Phenom II X2 570 BE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core i7-6900K | AMD Phenom II X2 570 BE |
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PassMark - Single thread mark | 2329 | 1412 |
PassMark - CPU mark | 14476 | 1395 |
Geekbench 4 - Single Core | 1005 | 2107 |
Geekbench 4 - Multi-Core | 7893 | 3615 |
3DMark Fire Strike - Physics Score | 8778 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 10.395 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 179.127 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 1.3 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 5.194 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 13.602 |
Compare specifications (specs)
Intel Core i7-6900K | AMD Phenom II X2 570 BE | |
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Essentials |
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Architecture codename | Broadwell E | Callisto |
Launch date | May 2016 | May 2010 |
Launch price (MSRP) | $1,020 | |
Place in performance rating | 1400 | 1422 |
Price now | $1,198.99 | |
Processor Number | i7-6900K | |
Series | Intel® Core™ X-series Processors | |
Status | Discontinued | |
Value for money (0-100) | 4.35 | |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 3.20 GHz | |
L1 cache | 32 KB (per core) | 128 KB (per core) |
L2 cache | 256 KB (per core) | 512 KB (per core) |
L3 cache | 20480 KB (shared) | 6144 KB (shared) |
Manufacturing process technology | 14 nm | 45 nm |
Maximum case temperature (TCase) | 72 °C | |
Maximum frequency | 3.70 GHz | 3.5 GHz |
Number of cores | 8 | 2 |
Number of threads | 16 | |
Unlocked | ||
Die size | 258 mm | |
Transistor count | 758 million | |
Memory |
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Max memory channels | 4 | |
Maximum memory size | 128 GB | |
Supported memory types | DDR4 2400/2133 | DDR3 |
Graphics |
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Processor graphics | None | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FCLGA2011-3 | AM3 |
Thermal Design Power (TDP) | 140 Watt | 80 Watt |
Peripherals |
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Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Smart Response technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Turbo Boost Max 3.0 | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |