Intel Core i7-7500U vs Intel Core i3-2312M
Comparative analysis of Intel Core i7-7500U and Intel Core i3-2312M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i7-7500U
- CPU is newer: launch date 5 year(s) 6 month(s) later
- Around 67% higher clock speed: 3.50 GHz vs 2.1 GHz
- Around 18% higher maximum core temperature: 100°C vs 85 C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
- Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
- 2x more maximum memory size: 32 GB vs 16 GB
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
- 2.1x better performance in PassMark - Single thread mark: 1919 vs 902
- 3.1x better performance in PassMark - CPU mark: 3645 vs 1159
Specifications (specs) | |
Launch date | 30 August 2016 vs 20 February 2011 |
Maximum frequency | 3.50 GHz vs 2.1 GHz |
Maximum core temperature | 100°C vs 85 C |
Manufacturing process technology | 14 nm vs 32 nm |
L3 cache | 4 MB vs 3072 KB |
Maximum memory size | 32 GB vs 16 GB |
Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 1919 vs 902 |
PassMark - CPU mark | 3645 vs 1159 |
Reasons to consider the Intel Core i3-2312M
- 3.6x better performance in Geekbench 4 - Single Core: 1963 vs 548
- 2.9x better performance in Geekbench 4 - Multi-Core: 3645 vs 1254
Benchmarks | |
Geekbench 4 - Single Core | 1963 vs 548 |
Geekbench 4 - Multi-Core | 3645 vs 1254 |
Compare benchmarks
CPU 1: Intel Core i7-7500U
CPU 2: Intel Core i3-2312M
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core i7-7500U | Intel Core i3-2312M |
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PassMark - Single thread mark | 1919 | 902 |
PassMark - CPU mark | 3645 | 1159 |
Geekbench 4 - Single Core | 548 | 1963 |
Geekbench 4 - Multi-Core | 1254 | 3645 |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 2.5 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 41.612 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.301 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.092 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 3.009 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 1553 | |
GFXBench 4.0 - Manhattan (Frames) | 2764 | |
GFXBench 4.0 - T-Rex (Frames) | 5150 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 1553 | |
GFXBench 4.0 - Manhattan (Fps) | 2764 | |
GFXBench 4.0 - T-Rex (Fps) | 5150 |
Compare specifications (specs)
Intel Core i7-7500U | Intel Core i3-2312M | |
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Essentials |
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Architecture codename | Kaby Lake | Sandy Bridge |
Launch date | 30 August 2016 | 20 February 2011 |
Launch price (MSRP) | $393 | $225 |
Place in performance rating | 1670 | 1686 |
Processor Number | i7-7500U | i3-2312M |
Series | 7th Generation Intel® Core™ i7 Processors | Legacy Intel® Core™ Processors |
Status | Launched | Launched |
Vertical segment | Mobile | Mobile |
Performance |
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64 bit support | ||
Base frequency | 2.70 GHz | 2.10 GHz |
Bus Speed | 4 GT/s OPI | 5 GT/s DMI |
L1 cache | 128 KB | 128 KB |
L2 cache | 512 KB | 512 KB |
L3 cache | 4 MB | 3072 KB |
Manufacturing process technology | 14 nm | 32 nm |
Maximum core temperature | 100°C | 85 C |
Maximum frequency | 3.50 GHz | 2.1 GHz |
Number of cores | 2 | 2 |
Number of threads | 4 | 4 |
Die size | 149 mm | |
Maximum case temperature (TCase) | 85 °C | |
Transistor count | 624 Million | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 34.1 GB/s | 21.3 GB/s |
Maximum memory size | 32 GB | 16 GB |
Supported memory types | DDR4-2133, LPDDR3-1866, DDR3L-1600 | DDR3 1066/1333 |
Graphics |
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Device ID | 0x5916 | 0x116 |
Graphics base frequency | 300 MHz | 650 MHz |
Graphics max dynamic frequency | 1.05 GHz | 1.10 GHz |
Graphics max frequency | 1.05 GHz | 1.1 GHz |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 32 GB | |
Processor graphics | Intel® HD Graphics 620 | Intel® HD Graphics 3000 |
Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 2 |
CRT | ||
SDVO | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
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Configurable TDP-down | 7.5 W | |
Configurable TDP-down Frequency | 800 MHz | |
Configurable TDP-up | 25 W | |
Configurable TDP-up Frequency | 2.90 GHz | |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 42mm X 24mm | 37.5mm x 37.5mm *rPGA988B); |
Sockets supported | FCBGA1356 | PPGA988 |
Thermal Design Power (TDP) | 15 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 12 | 16 |
PCI Express revision | 3.0 | 2.0 |
PCIe configurations | 1x4, 2x2, 1x2+2x1 and 4x1 | 1x16, 2x8, 1x8+2x4 |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Anti-Theft technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® AVX |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Smart Response technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Speed Shift technology | ||
Thermal Monitoring | ||
4G WiMAX Wireless | ||
Flexible Display interface (FDI) | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |