Intel Core i7-8665UE vs Intel Core i7-4770TE
Comparative analysis of Intel Core i7-8665UE and Intel Core i7-4770TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i7-8665UE
- Around 33% higher clock speed: 4.40 GHz vs 3.30 GHz
- Around 40% higher maximum core temperature: 100 °C vs 71.45°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 2x more maximum memory size: 64 GB vs 32 GB
- 3x lower typical power consumption: 15 Watt vs 45 Watt
- Around 6% better performance in PassMark - CPU mark: 5170 vs 4877
| Specifications (specs) | |
| Maximum frequency | 4.40 GHz vs 3.30 GHz |
| Maximum core temperature | 100 °C vs 71.45°C |
| Manufacturing process technology | 14 nm vs 22 nm |
| Maximum memory size | 64 GB vs 32 GB |
| Thermal Design Power (TDP) | 15 Watt vs 45 Watt |
| Benchmarks | |
| PassMark - CPU mark | 5170 vs 4877 |
Reasons to consider the Intel Core i7-4770TE
- Around 2% better performance in PassMark - Single thread mark: 1653 vs 1621
| Benchmarks | |
| PassMark - Single thread mark | 1653 vs 1621 |
Compare benchmarks
CPU 1: Intel Core i7-8665UE
CPU 2: Intel Core i7-4770TE
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i7-8665UE | Intel Core i7-4770TE |
|---|---|---|
| PassMark - Single thread mark | 1621 | 1653 |
| PassMark - CPU mark | 5170 | 4877 |
Compare specifications (specs)
| Intel Core i7-8665UE | Intel Core i7-4770TE | |
|---|---|---|
Essentials |
||
| Architecture codename | Whiskey Lake | Haswell |
| Launch date | Q2'19 | June 2013 |
| Launch price (MSRP) | $409 | |
| Place in performance rating | 1423 | 1416 |
| Processor Number | i7-8665UE | i7-4770TE |
| Series | 8th Generation Intel Core i7 Processors | 4th Generation Intel® Core™ i7 Processors |
| Status | Launched | Launched |
| Vertical segment | Embedded | Embedded |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.70 GHz | 2.30 GHz |
| L1 cache | 256 KB | 64 KB (per core) |
| L2 cache | 1 MB | 256 KB (per core) |
| L3 cache | 8 MB | 8192 KB (shared) |
| Manufacturing process technology | 14 nm | 22 nm |
| Maximum core temperature | 100 °C | 71.45°C |
| Maximum frequency | 4.40 GHz | 3.30 GHz |
| Number of cores | 4 | 4 |
| Number of threads | 8 | 8 |
| Bus Speed | 5 GT/s DMI | |
| Die size | 177 mm | |
| Maximum case temperature (TCase) | 71 °C | |
| Transistor count | 1400 million | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 37.5 GB/s | 25.6 GB/s |
| Maximum memory size | 64 GB | 32 GB |
| Supported memory types | DDR4-2400, LPDDR3-2133 | DDR3 1333/1600 |
Graphics |
||
| Execution Units | 24 | |
| Graphics base frequency | 300 MHz | 350 MHz |
| Graphics max dynamic frequency | 1.15 GHz | 1.00 GHz |
| Intel® Quick Sync Video | ||
| Processor graphics | Intel UHD Graphics 620 | Intel® HD Graphics 4600 |
| Graphics max frequency | 1 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Max video memory | 2 GB | |
Graphics interfaces |
||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | 3 |
| VGA | ||
| Wireless Display (WiDi) support | ||
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2304@60Hz | |
| Max resolution over eDP | 4096x2304@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2160@30/24Hz | N / A |
Graphics API support |
||
| DirectX | 12 | 11.2/12 |
| OpenGL | 4.5 | 4.3 |
Compatibility |
||
| Configurable TDP-down | 12.5 Watt | |
| Configurable TDP-down Frequency | 1.30 GHz | |
| Configurable TDP-up | 25 Watt | |
| Configurable TDP-up Frequency | 2.00 GHz | |
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 46 x 24 | 37.5mm x 37.5mm (LGA1150) |
| Sockets supported | FCBGA1528 | FCLGA1150 |
| Thermal Design Power (TDP) | 15 Watt | 45 Watt |
| Low Halogen Options Available | ||
| Thermal Solution | PCG 2013B | |
Peripherals |
||
| Max number of PCIe lanes | 16 | 16 |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | 1x4, 2x2, 1x2+2x1 and 4x1 | 1x16 |
| Scalability | 1S Only | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Anti-Theft technology | ||
| Intel® Identity Protection technology | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| Flexible Display interface (FDI) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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