Intel Core i9-13900TE vs AMD Ryzen 5 PRO 4650U
Comparative analysis of Intel Core i9-13900TE and AMD Ryzen 5 PRO 4650U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i9-13900TE
- CPU is newer: launch date 2 year(s) 7 month(s) later
- 18 more cores, run more applications at once: 24 vs 6
- 20 more threads: 32 vs 12
- Around 25% higher clock speed: 5.00 GHz vs 4.0 GHz
- 5x more L1 cache, more data can be stored in the L1 cache for quick access later
- 10.7x more L2 cache, more data can be stored in the L2 cache for quick access later
- 4.5x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2x more maximum memory size: 128 GB vs 64 GB
- Around 32% better performance in PassMark - CPU mark: 16265 vs 12357
| Specifications (specs) | |
| Launch date | 4 Jan 2023 vs 7 May 2020 |
| Number of cores | 24 vs 6 |
| Number of threads | 32 vs 12 |
| Maximum frequency | 5.00 GHz vs 4.0 GHz |
| L1 cache | 1920 KB vs 384 KB |
| L2 cache | 32 MB vs 3 MB |
| L3 cache | 36 MB vs 8 MB |
| Maximum memory size | 128 GB vs 64 GB |
| Benchmarks | |
| PassMark - CPU mark | 16265 vs 12357 |
Reasons to consider the AMD Ryzen 5 PRO 4650U
- Around 5% higher maximum core temperature: 105 °C vs 100°C
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
- Around 10% better performance in PassMark - Single thread mark: 2399 vs 2181
| Specifications (specs) | |
| Maximum core temperature | 105 °C vs 100°C |
| Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 2399 vs 2181 |
Compare benchmarks
CPU 1: Intel Core i9-13900TE
CPU 2: AMD Ryzen 5 PRO 4650U
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i9-13900TE | AMD Ryzen 5 PRO 4650U |
|---|---|---|
| PassMark - Single thread mark | 2181 | 2399 |
| PassMark - CPU mark | 16265 | 12357 |
Compare specifications (specs)
| Intel Core i9-13900TE | AMD Ryzen 5 PRO 4650U | |
|---|---|---|
Essentials |
||
| Architecture codename | Raptor Lake | Zen 2 |
| Launch date | 4 Jan 2023 | 7 May 2020 |
| Place in performance rating | 1015 | 960 |
| Processor Number | i9-13900TE | |
| Series | 13th Generation Intel Core i9 Processors | |
| Vertical segment | Embedded | Laptop |
| OPN Tray | 100-000000103 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.00 GHz | 2.1 GHz |
| L1 cache | 1920 KB | 384 KB |
| L2 cache | 32 MB | 3 MB |
| L3 cache | 36 MB | 8 MB |
| Manufacturing process technology | 7 nm | 7 nm |
| Maximum core temperature | 100°C | 105 °C |
| Maximum frequency | 5.00 GHz | 4.0 GHz |
| Number of cores | 24 | 6 |
| Number of threads | 32 | 12 |
| Number of GPU cores | 6 | |
| Unlocked | ||
Memory |
||
| Max memory channels | 2 | 4 |
| Maximum memory bandwidth | 89.6 GB/s | 68.27 GB/s |
| Maximum memory size | 128 GB | 64 GB |
| Supported memory types | Up to DDR5 5600 MT/s Up to DDR4 3200 MT/s | DDR4-3200, LPDDR4-4266 |
Graphics |
||
| Device ID | 0xA780 | |
| Execution Units | 32 | |
| Graphics base frequency | 300 MHz | |
| Graphics max dynamic frequency | 1.65 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel UHD Graphics 770 | |
Graphics interfaces |
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| Number of displays supported | 4 | |
| DisplayPort | ||
| HDMI | ||
Graphics image quality |
||
| Max resolution over DisplayPort | 7680 x 4320 @ 60Hz | |
| Max resolution over eDP | 5120 x 3200 @ 120Hz | |
Graphics API support |
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| DirectX | 12 | |
| OpenGL | 4.5 | |
Compatibility |
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| Max number of CPUs in a configuration | 1 | |
| Package Size | 45.0 mm x 37.5 mm | |
| Thermal Design Power (TDP) | 35 Watt | 15 Watt |
| Thermal Solution | PCG 2020C | |
| Sockets supported | FP6 | |
Peripherals |
||
| Max number of PCIe lanes | 20 | 16 |
| PCI Express revision | 5.0 and 4.0 | 3.0 |
| PCIe configurations | Up to 1x16+4, 2x8+4 | 1x8+1x4+1x4, 2x4+1x4+1x4 |
| Scalability | 1S Only | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Intel® Volume Management Device (VMD) | ||
| Speed Shift technology | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||