Intel Atom x6414RE vs Intel Mobile Pentium 4 3.06

Comparative analysis of Intel Atom x6414RE and Intel Mobile Pentium 4 3.06 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Atom x6414RE

Intel Mobile Pentium 4 3.06

Differences

Reasons to consider the Intel Atom x6414RE

3 more cores, run more applications at once: 4 vs 1
A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 130 nm
3x more L2 cache, more data can be stored in the L2 cache for quick access later
7.8x lower typical power consumption: 9 Watt vs 70 Watt
4.4x better performance in PassMark - CPU mark: 1544 vs 347

Specifications (specs)
Number of cores	4 vs 1
Manufacturing process technology	10 nm vs 130 nm
L2 cache	1.5 MB vs 512 KB
Thermal Design Power (TDP)	9 Watt vs 70 Watt
Benchmarks
PassMark - CPU mark	1544 vs 347

Reasons to consider the Intel Mobile Pentium 4 3.06

Around 8% better performance in PassMark - Single thread mark: 657 vs 608

Benchmarks
PassMark - Single thread mark	657 vs 608

Compare benchmarks

CPU 1: Intel Atom x6414RE
CPU 2: Intel Mobile Pentium 4 3.06

PassMark - Single thread mark

CPU 1

CPU 2

608

657

PassMark - CPU mark

CPU 1

CPU 2

1544

347

Name	Intel Atom x6414RE	Intel Mobile Pentium 4 3.06
PassMark - Single thread mark	608	657
PassMark - CPU mark	1544	347

Compare specifications (specs)

	Intel Atom x6414RE	Intel Mobile Pentium 4 3.06
Essentials
Architecture codename	Elkhart Lake	Northwood
Launch date	Q1'21	June 2003
Launch price (MSRP)	$55
Place in performance rating	2783	2771
Processor Number	6414RE
Series	Intel Atom Processor X Series
Vertical segment	Embedded	Laptop
Performance
64 bit support
Base frequency	1.50 GHz
L2 cache	1.5 MB	512 KB
Manufacturing process technology	10 nm	130 nm
Maximum core temperature	110°C
Number of cores	4	1
Number of threads	4
Operating Temperature Range	-40°C to 85°C
Die size		131 mm
L1 cache		8 KB
Maximum case temperature (TCase)		74 °C
Maximum frequency		3.07 GHz
Transistor count		55 million
Memory
Max memory channels	4
Maximum memory bandwidth	51.2 GB/s
Maximum memory size	32 GB
Supported memory types	4x32 LPDDR4/x 3200MT/s Max 16GB / 2x64 DDR4 3200MT/s Max 32GB, LPDDR4/x & DDR4 with In Band ECC,	DDR1, DDR2
Graphics
Execution Units	16
Graphics base frequency	400 MHz
Intel® Quick Sync Video
Processor graphics	Intel UHD Graphics for 10th Gen Intel Processors
Graphics interfaces
DisplayPort
eDP
HDMI
MIPI-DSI
Number of displays supported	3
Graphics image quality
4K resolution support
Max resolution over DisplayPort	4096x2160@ 60Hz
Max resolution over eDP	4096x2160@ 60Hz
Graphics API support
DirectX	Yes
OpenGL	Yes
Compatibility
Max number of CPUs in a configuration	1	1
Package Size	35mm x 24mm
Sockets supported	FCBGA1493	478
Thermal Design Power (TDP)	9 Watt	70 Watt
Peripherals
Integrated LAN
Max number of PCIe lanes	8
Number of USB ports	4
PCI Express revision	3.0
PCIe configurations	PCIe 0: 1 x4/2 x2/1 x2 + 2 x1/4 x1, PCIe 1-3: 1 x2/1 x1
Total number of SATA ports	2
UART
USB revision	2.0/3.0/3.1
Security & Reliability
Execute Disable Bit (EDB)
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
General-Purpose Input/Output (GPIO)
HD Audio
Idle States
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)