Intel Pentium 4 1.80 vs AMD Athlon XP 3200+

Comparative analysis of Intel Pentium 4 1.80 and AMD Athlon XP 3200+ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Pentium 4 1.80

  • CPU is newer: launch date 7 month(s) later
  • Around 15% lower typical power consumption: 66.7 Watt vs 77 Watt
Launch date August 2001 vs January 2001
Thermal Design Power (TDP) 66.7 Watt vs 77 Watt

Reasons to consider the AMD Athlon XP 3200+

  • Around 22% higher clock speed: 2.2 GHz vs 1.8 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 130 nm vs 180 nm
  • 16x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 76% better performance in PassMark - CPU mark: 281 vs 160
Specifications (specs)
Maximum frequency 2.2 GHz vs 1.8 GHz
Manufacturing process technology 130 nm vs 180 nm
L1 cache 128 KB vs 8 KB
L2 cache 512 KB vs 256 KB
Benchmarks
PassMark - Single thread mark 430 vs 429
PassMark - CPU mark 281 vs 160

Compare benchmarks

CPU 1: Intel Pentium 4 1.80
CPU 2: AMD Athlon XP 3200+

PassMark - Single thread mark
CPU 1
CPU 2
429
430
PassMark - CPU mark
CPU 1
CPU 2
160
281
Name Intel Pentium 4 1.80 AMD Athlon XP 3200+
PassMark - Single thread mark 429 430
PassMark - CPU mark 160 281

Compare specifications (specs)

Intel Pentium 4 1.80 AMD Athlon XP 3200+

Essentials

Architecture codename Willamette Barton
Launch date August 2001 January 2001
Place in performance rating 3105 3106
Series Legacy Intel® Pentium® Processor
Status Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 1.80 GHz
Bus Speed 400 MHz FSB
Die size 217 mm2 101 mm
L1 cache 8 KB 128 KB
L2 cache 256 KB 512 KB
Manufacturing process technology 180 nm 130 nm
Maximum case temperature (TCase) 78 °C
Maximum core temperature 78°C
Maximum frequency 1.8 GHz 2.2 GHz
Number of cores 1 1
Transistor count 42 million 63 million
VID voltage range 1.575V-1.75V

Memory

Supported memory types DDR1, DDR2

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 53.3mm x 53.3mm
Sockets supported PPGA478, PPGA423 A
Thermal Design Power (TDP) 66.7 Watt 77 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology

Virtualization

Intel® Virtualization Technology (VT-x)