Intel Pentium 4 2.0 vs Intel Pentium 4 HT 515
Comparative analysis of Intel Pentium 4 2.0 and Intel Pentium 4 HT 515 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Pentium 4 2.0
- Around 56% lower typical power consumption: 54.3 Watt vs 84 Watt
| Thermal Design Power (TDP) | 54.3 Watt vs 84 Watt |
Reasons to consider the Intel Pentium 4 HT 515
- Around 47% higher clock speed: 2.93 GHz vs 2 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
| Maximum frequency | 2.93 GHz vs 2 GHz |
| Manufacturing process technology | 90 nm vs 130 nm |
| L1 cache | 16 KB vs 8 KB |
| L2 cache | 1024 KB vs 512 KB |
Compare specifications (specs)
| Intel Pentium 4 2.0 | Intel Pentium 4 HT 515 | |
|---|---|---|
Essentials |
||
| Architecture codename | Northwood | Prescott |
| Launch date | Q1'02 | January 2001 |
| Place in performance rating | not rated | not rated |
| Series | Legacy Intel® Pentium® Processor | |
| Status | Discontinued | |
| Vertical segment | Desktop | Desktop |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.00 GHz | |
| Bus Speed | 400 MHz FSB | |
| Die size | 131 mm2 | 109 mm |
| L1 cache | 8 KB | 16 KB |
| L2 cache | 512 KB | 1024 KB |
| Manufacturing process technology | 130 nm | 90 nm |
| Maximum case temperature (TCase) | 74 °C | |
| Maximum core temperature | 69°C | |
| Maximum frequency | 2 GHz | 2.93 GHz |
| Number of cores | 1 | 1 |
| Transistor count | 55 million | 125 million |
| VID voltage range | 1.360V-1.435V | |
Memory |
||
| Supported memory types | DDR1, DDR2 | DDR1, DDR2, DDR3 |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 35mm x 35mm | |
| Sockets supported | PPGA478 | 775 |
| Thermal Design Power (TDP) | 54.3 Watt | 84 Watt |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||