Intel Pentium 4 2.0 vs Intel Pentium 4 HT 517
Comparative analysis of Intel Pentium 4 2.0 and Intel Pentium 4 HT 517 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Pentium 4 2.0
- Around 2% higher maximum core temperature: 69°C vs 67.7°C
- Around 56% lower typical power consumption: 54.3 Watt vs 84 Watt
Maximum core temperature | 69°C vs 67.7°C |
Thermal Design Power (TDP) | 54.3 Watt vs 84 Watt |
Reasons to consider the Intel Pentium 4 HT 517
- Around 47% higher clock speed: 2.93 GHz vs 2 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency | 2.93 GHz vs 2 GHz |
Manufacturing process technology | 90 nm vs 130 nm |
L1 cache | 16 KB vs 8 KB |
L2 cache | 1024 KB vs 512 KB |
Compare specifications (specs)
Intel Pentium 4 2.0 | Intel Pentium 4 HT 517 | |
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Essentials |
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Architecture codename | Northwood | Prescott |
Launch date | Q1'02 | Q3'05 |
Place in performance rating | not rated | not rated |
Series | Legacy Intel® Pentium® Processor | Legacy Intel® Pentium® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Desktop |
Processor Number | 517 | |
Performance |
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64 bit support | ||
Base frequency | 2.00 GHz | 2.93 GHz |
Bus Speed | 400 MHz FSB | 533 MHz FSB |
Die size | 131 mm2 | 112 mm2 |
L1 cache | 8 KB | 16 KB |
L2 cache | 512 KB | 1024 KB |
Manufacturing process technology | 130 nm | 90 nm |
Maximum case temperature (TCase) | 74 °C | |
Maximum core temperature | 69°C | 67.7°C |
Maximum frequency | 2 GHz | 2.93 GHz |
Number of cores | 1 | 1 |
Transistor count | 55 million | 125 million |
VID voltage range | 1.360V-1.435V | 1.250V-1.400V |
Memory |
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Supported memory types | DDR1, DDR2 | DDR1, DDR2, DDR3 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 35mm x 35mm | |
Sockets supported | PPGA478 | PLGA775 |
Thermal Design Power (TDP) | 54.3 Watt | 84 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |