Intel Pentium 4 HT 631 vs Intel Celeron D 346

Comparative analysis of Intel Pentium 4 HT 631 and Intel Celeron D 346 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.

Intel Pentium 4 HT 631

Intel Celeron D 346

Differences

Reasons to consider the Intel Pentium 4 HT 631

CPU is newer: launch date 1 year(s) 3 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
Around 75% more L1 cache; more data can be stored in the L1 cache for quick access later
8x more L2 cache, more data can be stored in the L2 cache for quick access later

Launch date	January 2006 vs October 2004
Manufacturing process technology	65 nm vs 90 nm
L1 cache	28 KB vs 16 KB
L2 cache	2048 KB vs 256 KB

Reasons to consider the Intel Celeron D 346

Around 2% higher clock speed: 3.06 GHz vs 3 GHz
Around 2% lower typical power consumption: 84 Watt vs 86 Watt

Maximum frequency	3.06 GHz vs 3 GHz
Thermal Design Power (TDP)	84 Watt vs 86 Watt

Compare specifications (specs)

	Intel Pentium 4 HT 631	Intel Celeron D 346
Essentials
Architecture codename	Cedarmill	Prescott
Launch date	January 2006	October 2004
Place in performance rating	not rated	not rated
Processor Number	631	346
Series	Legacy Intel® Pentium® Processor	Legacy Intel® Celeron® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.00 GHz	3.06 GHz
Bus Speed	800 MHz FSB	533 MHz FSB
Die size	81 mm2	112 mm2
L1 cache	28 KB	16 KB
L2 cache	2048 KB	256 KB
Manufacturing process technology	65 nm	90 nm
Maximum case temperature (TCase)	69 °C
Maximum core temperature	B1+C1=69.2°C. D0=64.1°C	67.7°C
Maximum frequency	3 GHz	3.06 GHz
Number of cores	1	1
Transistor count	188 million	125 million
VID voltage range	1.200V-1.3375V	1.250V-1.400V
Memory
Supported memory types	DDR1, DDR2, DDR3	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Scenario Design Power (SDP)	0 W
Sockets supported	PLGA775	PLGA775
Thermal Design Power (TDP)	86 Watt	84 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)	32-bit	32-bit
Thermal Monitoring
Intel® AES New Instructions
Virtualization
Intel® Virtualization Technology (VT-x)