Intel Pentium 4 HT 670 vs Intel Pentium D 820

Comparative analysis of Intel Pentium 4 HT 670 and Intel Pentium D 820 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Pentium 4 HT 670

  • Around 36% higher clock speed: 3.8 GHz vs 2.8 GHz
  • Around 10% higher maximum core temperature: 70.8°C vs 64.1°C
Maximum frequency 3.8 GHz vs 2.8 GHz
Maximum core temperature 70.8°C vs 64.1°C

Reasons to consider the Intel Pentium D 820

  • 1 more cores, run more applications at once: 2 vs 1
  • Around 21% lower typical power consumption: 95 Watt vs 115 Watt
Number of cores 2 vs 1
Max number of CPUs in a configuration 2 vs 1
Thermal Design Power (TDP) 95 Watt vs 115 Watt

Compare benchmarks

CPU 1: Intel Pentium 4 HT 670
CPU 2: Intel Pentium D 820

Name Intel Pentium 4 HT 670 Intel Pentium D 820
Geekbench 4 - Single Core 179
Geekbench 4 - Multi-Core 307

Compare specifications (specs)

Intel Pentium 4 HT 670 Intel Pentium D 820

Essentials

Architecture codename Prescott Smithfield
Launch date May 2005 May 2005
Place in performance rating not rated 3292
Processor Number 670 820
Series Legacy Intel® Pentium® Processor Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 3.80 GHz 2.80 GHz
Bus Speed 800 MHz FSB 800 MHz FSB
Die size 135 mm2 206 mm2
L1 cache 28 KB 28 KB
L2 cache 2048 KB 2048 KB
Manufacturing process technology 90 nm 90 nm
Maximum core temperature 70.8°C 64.1°C
Maximum frequency 3.8 GHz 2.8 GHz
Number of cores 1 2
Transistor count 169 million 230 million
VID voltage range 1.200V-1.400V 1.200V-1.400V
Front-side bus (FSB) 800 MHz
Number of threads 2

Memory

Supported memory types DDR1, DDR2, DDR3 DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 2
Package Size 37.5mm x 37.5mm 37.5mm x 37.5mm
Sockets supported PLGA775 PLGA775
Thermal Design Power (TDP) 115 Watt 95 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Intel® AES New Instructions
Physical Address Extensions (PAE) 32-bit

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

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