Intel Pentium 4 HT 670 vs Intel Pentium D 840

Comparative analysis of Intel Pentium 4 HT 670 and Intel Pentium D 840 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Pentium 4 HT 670

Intel Pentium D 840

Differences

Reasons to consider the Intel Pentium 4 HT 670

Around 19% higher clock speed: 3.8 GHz vs 3.2 GHz
Around 1% higher maximum core temperature: 70.8°C vs 69.8°C
Around 13% lower typical power consumption: 115 Watt vs 130 Watt

Maximum frequency	3.8 GHz vs 3.2 GHz
Maximum core temperature	70.8°C vs 69.8°C
Thermal Design Power (TDP)	115 Watt vs 130 Watt

Reasons to consider the Intel Pentium D 840

1 more cores, run more applications at once: 2 vs 1

Number of cores	2 vs 1
Max number of CPUs in a configuration	2 vs 1

Compare benchmarks

CPU 1: Intel Pentium 4 HT 670
CPU 2: Intel Pentium D 840

Name	Intel Pentium 4 HT 670	Intel Pentium D 840
Geekbench 4 - Single Core		186
Geekbench 4 - Multi-Core		309

Compare specifications (specs)

	Intel Pentium 4 HT 670	Intel Pentium D 840
Essentials
Architecture codename	Prescott	Smithfield
Launch date	May 2005	May 2005
Place in performance rating	not rated	3288
Processor Number	670	840
Series	Legacy Intel® Pentium® Processor	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.80 GHz	3.20 GHz
Bus Speed	800 MHz FSB	800 MHz FSB
Die size	135 mm2	206 mm2
L1 cache	28 KB	28 KB
L2 cache	2048 KB	2048 KB
Manufacturing process technology	90 nm	90 nm
Maximum core temperature	70.8°C	69.8°C
Maximum frequency	3.8 GHz	3.2 GHz
Number of cores	1	2
Transistor count	169 million	230 million
VID voltage range	1.200V-1.400V	1.200V-1.400V
Memory
Supported memory types	DDR1, DDR2, DDR3	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	2
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	PLGA775	PLGA775
Thermal Design Power (TDP)	115 Watt	130 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Intel® AES New Instructions
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)