Intel Pentium D 820 vs Intel Pentium 4 HT 630

Comparative analysis of Intel Pentium D 820 and Intel Pentium 4 HT 630 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Pentium D 820

  • CPU is newer: launch date 2 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • Around 7% better performance in Geekbench 4 - Single Core: 179 vs 168
  • Around 43% better performance in Geekbench 4 - Multi-Core: 307 vs 214
Specifications (specs)
Launch date May 2005 vs February 2005
Number of cores 2 vs 1
Max number of CPUs in a configuration 2 vs 1
Benchmarks
Geekbench 4 - Single Core 179 vs 168
Geekbench 4 - Multi-Core 307 vs 214

Reasons to consider the Intel Pentium 4 HT 630

  • Around 7% higher clock speed: 3 GHz vs 2.8 GHz
  • Around 4% higher maximum core temperature: 66.6°C vs 64.1°C
  • Around 13% lower typical power consumption: 84 Watt vs 95 Watt
Maximum frequency 3 GHz vs 2.8 GHz
Maximum core temperature 66.6°C vs 64.1°C
Thermal Design Power (TDP) 84 Watt vs 95 Watt

Compare benchmarks

CPU 1: Intel Pentium D 820
CPU 2: Intel Pentium 4 HT 630

Geekbench 4 - Single Core
CPU 1
CPU 2
179
168
Geekbench 4 - Multi-Core
CPU 1
CPU 2
307
214
Name Intel Pentium D 820 Intel Pentium 4 HT 630
Geekbench 4 - Single Core 179 168
Geekbench 4 - Multi-Core 307 214

Compare specifications (specs)

Intel Pentium D 820 Intel Pentium 4 HT 630

Essentials

Architecture codename Smithfield Prescott
Launch date May 2005 February 2005
Place in performance rating 3302 3310
Processor Number 820 630
Series Legacy Intel® Pentium® Processor Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 2.80 GHz 3.00 GHz
Bus Speed 800 MHz FSB 800 MHz FSB
Die size 206 mm2 135 mm2
Front-side bus (FSB) 800 MHz
L1 cache 28 KB 28 KB
L2 cache 2048 KB 2048 KB
Manufacturing process technology 90 nm 90 nm
Maximum core temperature 64.1°C 66.6°C
Maximum frequency 2.8 GHz 3 GHz
Number of cores 2 1
Number of threads 2
Transistor count 230 million 169 million
VID voltage range 1.200V-1.400V 1.200V-1.400V

Memory

Supported memory types DDR1, DDR2, DDR3 DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 1
Package Size 37.5mm x 37.5mm 37.5mm x 37.5mm
Sockets supported PLGA775 PLGA775
Thermal Design Power (TDP) 95 Watt 84 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 32-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)