Intel Pentium D 820 vs Intel Pentium 4 HT 630
Comparative analysis of Intel Pentium D 820 and Intel Pentium 4 HT 630 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Pentium D 820
- CPU is newer: launch date 2 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- Around 7% better performance in Geekbench 4 - Single Core: 179 vs 168
- Around 43% better performance in Geekbench 4 - Multi-Core: 307 vs 214
Specifications (specs) | |
Launch date | May 2005 vs February 2005 |
Number of cores | 2 vs 1 |
Max number of CPUs in a configuration | 2 vs 1 |
Benchmarks | |
Geekbench 4 - Single Core | 179 vs 168 |
Geekbench 4 - Multi-Core | 307 vs 214 |
Reasons to consider the Intel Pentium 4 HT 630
- Around 7% higher clock speed: 3 GHz vs 2.8 GHz
- Around 4% higher maximum core temperature: 66.6°C vs 64.1°C
- Around 13% lower typical power consumption: 84 Watt vs 95 Watt
Maximum frequency | 3 GHz vs 2.8 GHz |
Maximum core temperature | 66.6°C vs 64.1°C |
Thermal Design Power (TDP) | 84 Watt vs 95 Watt |
Compare benchmarks
CPU 1: Intel Pentium D 820
CPU 2: Intel Pentium 4 HT 630
Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Pentium D 820 | Intel Pentium 4 HT 630 |
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Geekbench 4 - Single Core | 179 | 168 |
Geekbench 4 - Multi-Core | 307 | 214 |
Compare specifications (specs)
Intel Pentium D 820 | Intel Pentium 4 HT 630 | |
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Essentials |
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Architecture codename | Smithfield | Prescott |
Launch date | May 2005 | February 2005 |
Place in performance rating | 3302 | 3310 |
Processor Number | 820 | 630 |
Series | Legacy Intel® Pentium® Processor | Legacy Intel® Pentium® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 2.80 GHz | 3.00 GHz |
Bus Speed | 800 MHz FSB | 800 MHz FSB |
Die size | 206 mm2 | 135 mm2 |
Front-side bus (FSB) | 800 MHz | |
L1 cache | 28 KB | 28 KB |
L2 cache | 2048 KB | 2048 KB |
Manufacturing process technology | 90 nm | 90 nm |
Maximum core temperature | 64.1°C | 66.6°C |
Maximum frequency | 2.8 GHz | 3 GHz |
Number of cores | 2 | 1 |
Number of threads | 2 | |
Transistor count | 230 million | 169 million |
VID voltage range | 1.200V-1.400V | 1.200V-1.400V |
Memory |
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Supported memory types | DDR1, DDR2, DDR3 | DDR1, DDR2, DDR3 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 1 |
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | PLGA775 | PLGA775 |
Thermal Design Power (TDP) | 95 Watt | 84 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 32-bit | |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |