Intel Pentium D 965 EE vs AMD Opteron X2 275 HE
Comparative analysis of Intel Pentium D 965 EE and AMD Opteron X2 275 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Pentium D 965 EE
- Around 70% higher clock speed: 3.73 GHz vs 2.2 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
| Maximum frequency | 3.73 GHz vs 2.2 GHz |
| Manufacturing process technology | 65 nm vs 90 nm |
| L2 cache | 4096 KB vs 1024 KB |
Reasons to consider the AMD Opteron X2 275 HE
- 4.6x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2.4x lower typical power consumption: 55 Watt vs 130 Watt
| L1 cache | 128 KB vs 28 KB |
| Thermal Design Power (TDP) | 55 Watt vs 130 Watt |
Compare specifications (specs)
| Intel Pentium D 965 EE | AMD Opteron X2 275 HE | |
|---|---|---|
Essentials |
||
| Architecture codename | Presler | Italy |
| Launch date | March 2006 | February 2006 |
| Place in performance rating | not rated | not rated |
| Processor Number | 965 | |
| Series | Legacy Intel® Pentium® Processor | |
| Status | Discontinued | |
| Vertical segment | Desktop | Server |
Performance |
||
| 64 bit support | ||
| Base frequency | 3.73 GHz | |
| Bus Speed | 1066 MHz FSB | |
| Die size | 162 mm2 | |
| L1 cache | 28 KB | 128 KB |
| L2 cache | 4096 KB | 1024 KB |
| Manufacturing process technology | 65 nm | 90 nm |
| Maximum core temperature | 68.6°C | |
| Maximum frequency | 3.73 GHz | 2.2 GHz |
| Number of cores | 2 | 2 |
| Transistor count | 376 million | 233 million |
| VID voltage range | 1.200V-1.3375V | |
Memory |
||
| Supported memory types | DDR1, DDR2, DDR3 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 2 | 2 |
| Package Size | 37.5mm x 37.5mm | |
| Sockets supported | PLGA775 | 940 |
| Thermal Design Power (TDP) | 130 Watt | 55 Watt |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Physical Address Extensions (PAE) | 32-bit | |
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||