Intel Pentium D 965 EE vs Intel Core Duo T2600
Comparative analysis of Intel Pentium D 965 EE and Intel Core Duo T2600 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Pentium D 965 EE
- CPU is newer: launch date 1 month(s) later
- Around 73% higher clock speed: 3.73 GHz vs 2.16 GHz
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
| Launch date | March 2006 vs 5 January 2006 |
| Maximum frequency | 3.73 GHz vs 2.16 GHz |
| L2 cache | 4096 KB vs 2048 KB |
| Max number of CPUs in a configuration | 2 vs 1 |
Reasons to consider the Intel Core Duo T2600
- Around 46% higher maximum core temperature: 100°C vs 68.6°C
- 4.2x lower typical power consumption: 31 Watt vs 130 Watt
| Maximum core temperature | 100°C vs 68.6°C |
| Thermal Design Power (TDP) | 31 Watt vs 130 Watt |
Compare benchmarks
CPU 1: Intel Pentium D 965 EE
CPU 2: Intel Core Duo T2600
| Name | Intel Pentium D 965 EE | Intel Core Duo T2600 |
|---|---|---|
| PassMark - Single thread mark | 667 | |
| PassMark - CPU mark | 460 |
Compare specifications (specs)
| Intel Pentium D 965 EE | Intel Core Duo T2600 | |
|---|---|---|
Essentials |
||
| Architecture codename | Presler | Yonah |
| Launch date | March 2006 | 5 January 2006 |
| Place in performance rating | not rated | 2763 |
| Processor Number | 965 | T2600 |
| Series | Legacy Intel® Pentium® Processor | Legacy Intel® Core™ Processors |
| Status | Discontinued | Discontinued |
| Vertical segment | Desktop | Mobile |
| Launch price (MSRP) | $440 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 3.73 GHz | 2.16 GHz |
| Bus Speed | 1066 MHz FSB | 667 MHz FSB |
| Die size | 162 mm2 | 90 mm2 |
| L1 cache | 28 KB | |
| L2 cache | 4096 KB | 2048 KB |
| Manufacturing process technology | 65 nm | 65 nm |
| Maximum core temperature | 68.6°C | 100°C |
| Maximum frequency | 3.73 GHz | 2.16 GHz |
| Number of cores | 2 | 2 |
| Transistor count | 376 million | 151 million |
| VID voltage range | 1.200V-1.3375V | 1.1625V - 1.30V |
| Front-side bus (FSB) | 667 MHz | |
| Number of threads | 2 | |
Memory |
||
| Supported memory types | DDR1, DDR2, DDR3 | DDR1 |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 2 | 1 |
| Package Size | 37.5mm x 37.5mm | 35mm x 35mm |
| Sockets supported | PLGA775 | PPGA478, PBGA479 |
| Thermal Design Power (TDP) | 130 Watt | 31 Watt |
| Scenario Design Power (SDP) | 0 W | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Physical Address Extensions (PAE) | 32-bit | 32-bit |
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
