Intel Pentium Dual Core T3400 vs Intel Core Duo T2300

Comparative analysis of Intel Pentium Dual Core T3400 and Intel Core Duo T2300 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Pentium Dual Core T3400

  • CPU is newer: launch date 2 year(s) 8 month(s) later
  • Around 30% higher clock speed: 2.16 GHz vs 1.66 GHz
  • Around 44% better performance in PassMark - Single thread mark: 732 vs 509
  • 2x better performance in PassMark - CPU mark: 653 vs 325
Specifications (specs)
Launch date 1 October 2008 vs January 2006
Maximum frequency 2.16 GHz vs 1.66 GHz
Benchmarks
PassMark - Single thread mark 732 vs 509
PassMark - CPU mark 653 vs 325

Reasons to consider the Intel Core Duo T2300

  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 13% lower typical power consumption: 31 Watt vs 35 Watt
L2 cache 2048 KB vs 1024 KB
Thermal Design Power (TDP) 31 Watt vs 35 Watt

Compare benchmarks

CPU 1: Intel Pentium Dual Core T3400
CPU 2: Intel Core Duo T2300

PassMark - Single thread mark
CPU 1
CPU 2
732
509
PassMark - CPU mark
CPU 1
CPU 2
653
325
Name Intel Pentium Dual Core T3400 Intel Core Duo T2300
PassMark - Single thread mark 732 509
PassMark - CPU mark 653 325
Geekbench 4 - Single Core 251
Geekbench 4 - Multi-Core 447

Compare specifications (specs)

Intel Pentium Dual Core T3400 Intel Core Duo T2300

Essentials

Architecture codename Merom Yonah
Launch date 1 October 2008 January 2006
Place in performance rating 2985 2994
Processor Number T3400 T2300
Series Legacy Intel® Pentium® Processor Legacy Intel® Core™ Processors
Status Discontinued Discontinued
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 2.16 GHz 1.66 GHz
Bus Speed 667 MHz FSB 667 MHz FSB
Die size 143 mm2 90 mm2
Front-side bus (FSB) 667 MHz 667 MHz
L2 cache 1024 KB 2048 KB
Manufacturing process technology 65 nm 65 nm
Maximum core temperature 100°C 100°C
Maximum frequency 2.16 GHz 1.66 GHz
Number of cores 2 2
Number of threads 2 2
Transistor count 291 million 151 million
VID voltage range 1.075V-1.175V 1.1625V - 1.30V

Compatibility

Low Halogen Options Available
Sockets supported PPGA478 PPGA478, PBGA479
Thermal Design Power (TDP) 35 Watt 31 Watt
Max number of CPUs in a configuration 1
Package Size 35mm x 35mm
Scenario Design Power (SDP) 0 W

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 32-bit

Virtualization

Intel® Virtualization Technology (VT-x)

Memory

Supported memory types DDR1