Intel Xeon D-2799 vs Intel Xeon Gold 6230

Comparative analysis of Intel Xeon D-2799 and Intel Xeon Gold 6230 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Xeon D-2799

Intel Xeon Gold 6230

Differences

Reasons to consider the Intel Xeon D-2799

A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
Around 9% more L3 cache; more data can be stored in the L3 cache for quick access later
Around 14% better performance in PassMark - Single thread mark: 2404 vs 2105

Specifications (specs)
Manufacturing process technology	10 nm vs 14 nm
L3 cache	30 MB vs 27.5 MB
Benchmarks
PassMark - Single thread mark	2404 vs 2105

Reasons to consider the Intel Xeon Gold 6230

Around 15% higher clock speed: 3.90 GHz vs 3.40 GHz
Around 3% lower typical power consumption: 125 Watt vs 129 Watt
Around 31% better performance in PassMark - CPU mark: 44374 vs 33792

Specifications (specs)
Maximum frequency	3.90 GHz vs 3.40 GHz
Thermal Design Power (TDP)	125 Watt vs 129 Watt
Benchmarks
PassMark - CPU mark	44374 vs 33792

Compare benchmarks

CPU 1: Intel Xeon D-2799
CPU 2: Intel Xeon Gold 6230

PassMark - Single thread mark

CPU 1

CPU 2

2404

2105

PassMark - CPU mark

CPU 1

CPU 2

33792

44374

Name	Intel Xeon D-2799	Intel Xeon Gold 6230
PassMark - Single thread mark	2404	2105
PassMark - CPU mark	33792	44374

Compare specifications (specs)

	Intel Xeon D-2799	Intel Xeon Gold 6230
Essentials
Architecture codename	Ice Lake	Cascade Lake
Launch date	Q1'22	2 April 2019
Launch price (MSRP)	$2050	$1894, $1900
Place in performance rating	648	641
Processor Number	D-2799	6230
Series	Intel Xeon D Processor	6200
Status	Launched
Vertical segment	Server	Server
Family		Xeon Gold
Performance
64 bit support
Base frequency	2.40 GHz	2.10 GHz
L3 cache	30 MB	27.5 MB
Manufacturing process technology	10 nm	14 nm
Maximum frequency	3.40 GHz	3.90 GHz
Number of cores	20	20
Number of threads	40	40
Bus Speed		4 × 8 GT/s
L1 cache		1.25 MB
L2 cache		20 MB
Maximum case temperature (TCase)		87 °C
Number of Ultra Path Interconnect (UPI) Links		3
Unlocked
Memory
Max memory channels	4	6
Maximum memory size	1 TB	1 TB
Supported memory frequency	3200 MHz	2933 MHz
Supported memory types	DDR4	DDR4-2933
ECC memory support
Maximum memory bandwidth		131.13 GB/s
Compatibility
Package Size	52.5 mm x 45 mm
Sockets supported	FCBGA2579	FCLGA3647
Thermal Design Power (TDP)	129 Watt	125 Watt
Peripherals
Integrated LAN
Max number of PCIe lanes	32	48
Max number of SATA 6 Gb/s Ports	24
Number of USB ports	4
PCI Express revision	4.0	3.0
Scalability	1S Only	4S
USB revision	3.0
Security & Reliability
Execute Disable Bit (EDB)
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Intel® Run Sure Technology
Mode-based Execute Control (MBE)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions	Intel AVX-512	Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
Integrated Intel® QuickAssist Technology
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units	1
Thermal Monitoring
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® TSX-NI
Intel® vPro™ Platform Eligibility
Speed Shift technology
Turbo Boost Max 3.0
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)