Intel Xeon E-2276ME vs Intel Core i7-4770TE

Comparative analysis of Intel Xeon E-2276ME and Intel Core i7-4770TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Xeon E-2276ME

Intel Core i7-4770TE

Differences

Reasons to consider the Intel Xeon E-2276ME

CPU is newer: launch date 5 year(s) 11 month(s) later
2 more cores, run more applications at once: 6 vs 4
4 more threads: 12 vs 8
Around 36% higher clock speed: 4.50 GHz vs 3.30 GHz
Around 40% higher maximum core temperature: 100 vs 71.45°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
2x more maximum memory size: 64 GB vs 32 GB
Around 64% better performance in PassMark - CPU mark: 8167 vs 4983

Specifications (specs)
Launch date	27 May 2019 vs June 2013
Number of cores	6 vs 4
Number of threads	12 vs 8
Maximum frequency	4.50 GHz vs 3.30 GHz
Maximum core temperature	100 vs 71.45°C
Manufacturing process technology	14 nm vs 22 nm
L1 cache	384 KB vs 64 KB (per core)
L2 cache	1.5 MB vs 256 KB (per core)
L3 cache	12 MB vs 8192 KB (shared)
Maximum memory size	64 GB vs 32 GB
Benchmarks
PassMark - CPU mark	8167 vs 4983

Reasons to consider the Intel Core i7-4770TE

Around 5% better performance in PassMark - Single thread mark: 1688 vs 1604

Benchmarks
PassMark - Single thread mark	1688 vs 1604

Compare benchmarks

CPU 1: Intel Xeon E-2276ME
CPU 2: Intel Core i7-4770TE

PassMark - Single thread mark

CPU 1

CPU 2

1604

1688

PassMark - CPU mark

CPU 1

CPU 2

8167

4983

Name	Intel Xeon E-2276ME	Intel Core i7-4770TE
PassMark - Single thread mark	1604	1688
PassMark - CPU mark	8167	4983

Compare specifications (specs)

	Intel Xeon E-2276ME	Intel Core i7-4770TE
Essentials
Architecture codename	Coffee Lake	Haswell
Launch date	27 May 2019	June 2013
Launch price (MSRP)	$450
Place in performance rating	1471	1483
Processor Number	E-2276ME	i7-4770TE
Series	Intel Xeon E Processor	4th Generation Intel® Core™ i7 Processors
Status	Launched	Launched
Vertical segment	Embedded	Embedded
Performance
64 bit support
Base frequency	2.80 GHz	2.30 GHz
Bus Speed	8 GT/s	5 GT/s DMI
L1 cache	384 KB	64 KB (per core)
L2 cache	1.5 MB	256 KB (per core)
L3 cache	12 MB	8192 KB (shared)
Manufacturing process technology	14 nm	22 nm
Maximum core temperature	100	71.45°C
Maximum frequency	4.50 GHz	3.30 GHz
Number of cores	6	4
Number of threads	12	8
Die size		177 mm
Maximum case temperature (TCase)		71 °C
Transistor count		1400 million
Memory
Max memory channels	2	2
Maximum memory size	64 GB	32 GB
Supported memory types	DDR4-2666	DDR3 1333/1600
Maximum memory bandwidth		25.6 GB/s
Graphics
Device ID	0x3E94
Graphics base frequency	350 MHz	350 MHz
Graphics max dynamic frequency	1.15 GHz	1.00 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	64 GB	2 GB
Processor graphics	Intel UHD Graphics P630	Intel® HD Graphics 4600
Graphics max frequency		1 GHz
Intel® Flexible Display Interface (Intel® FDI)
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3	3
VGA
Wireless Display (WiDi) support
Graphics image quality
4K resolution support
Max resolution over DisplayPort	4096x2304@30Hz
Max resolution over eDP	4096x2304@30Hz
Max resolution over HDMI 1.4		N / A
Graphics API support
DirectX	12	11.2/12
OpenGL	4.5	4.3
Compatibility
Configurable TDP-down	35 Watt
Max number of CPUs in a configuration	1	1
Package Size	42mm x 28mm	37.5mm x 37.5mm (LGA1150)
Sockets supported	FCBGA1440	FCLGA1150
Thermal Design Power (TDP)	45 Watt	45 Watt
Low Halogen Options Available
Thermal Solution		PCG 2013B
Peripherals
Max number of PCIe lanes	16	16
PCI Express revision	3.0	3.0
PCIe configurations	Up to 1x16, 2x8, 1x8+2x4	1x16
Scalability		1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Anti-Theft technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel SSE4.1, Intel SSE4.2, Intel AVX2	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Optane™ Memory Supported
Intel® Stable Image Platform Program (SIPP)
Intel® Turbo Boost technology
Speed Shift technology
Thermal Monitoring
Flexible Display interface (FDI)
Intel® Advanced Vector Extensions (AVX)
Intel® TSX-NI
Intel® vPro™ Platform Eligibility
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)