Intel Xeon E3-1220L v3 vs AMD Opteron 3350 HE
Comparative analysis of Intel Xeon E3-1220L v3 and AMD Opteron 3350 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Xeon E3-1220L v3
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 3.5x lower typical power consumption: 13 Watt vs 45 Watt
Manufacturing process technology | 22 nm vs 32 nm |
Thermal Design Power (TDP) | 13 Watt vs 45 Watt |
Reasons to consider the AMD Opteron 3350 HE
- 2 more cores, run more applications at once: 4 vs 2
- Around 153% higher clock speed: 3.8 GHz vs 1.50 GHz
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 63% better performance in PassMark - Single thread mark: 1263 vs 777
- 2.8x better performance in PassMark - CPU mark: 4009 vs 1407
Specifications (specs) | |
Number of cores | 4 vs 2 |
Maximum frequency | 3.8 GHz vs 1.50 GHz |
L1 cache | 192 KB vs 64 KB (per core) |
L2 cache | 4 MB vs 256 KB (per core) |
L3 cache | 8 MB vs 4096 KB (shared) |
Benchmarks | |
PassMark - Single thread mark | 1263 vs 777 |
PassMark - CPU mark | 4009 vs 1407 |
Compare benchmarks
CPU 1: Intel Xeon E3-1220L v3
CPU 2: AMD Opteron 3350 HE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon E3-1220L v3 | AMD Opteron 3350 HE |
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PassMark - Single thread mark | 777 | 1263 |
PassMark - CPU mark | 1407 | 4009 |
Geekbench 4 - Single Core | 1745 | |
Geekbench 4 - Multi-Core | 3086 |
Compare specifications (specs)
Intel Xeon E3-1220L v3 | AMD Opteron 3350 HE | |
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Essentials |
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Architecture codename | Haswell | Delhi |
Launch date | June 2013 | n/d |
Place in performance rating | 1878 | 1912 |
Processor Number | E3-1220LV3 | |
Series | Intel® Xeon® Processor E3 v3 Family | AMD Opteron 3300 Series Processor |
Status | Launched | |
Vertical segment | Server | Server |
Family | AMD Opteron | |
OPN Tray | OS3350HOW4KHK | |
Performance |
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64 bit support | ||
Base frequency | 1.10 GHz | 2.8 GHz |
Bus Speed | 5 GT/s DMI | |
Die size | 160 mm | 315 mm |
L1 cache | 64 KB (per core) | 192 KB |
L2 cache | 256 KB (per core) | 4 MB |
L3 cache | 4096 KB (shared) | 8 MB |
Manufacturing process technology | 22 nm | 32 nm |
Maximum frequency | 1.50 GHz | 3.8 GHz |
Number of cores | 2 | 4 |
Number of QPI Links | 0 | |
Number of threads | 4 | 4 |
Transistor count | 1400 million | 1200 million |
Maximum core temperature | 69.10°C | |
Unlocked | ||
Memory |
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ECC memory support | ||
Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3 1333/1600 | DDR3 |
Supported memory frequency | 2000 MHz | |
Graphics |
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Processor graphics | None | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1150 | AM3+ |
Thermal Design Power (TDP) | 13 Watt | 45 Watt |
Thermal Solution | PCG 2013A | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | 1x16, 2x8, 1x8/2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Fused Multiply-Add (FMA) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |