Intel Xeon X7350 vs Intel Xeon E3-1220L v3
Comparative analysis of Intel Xeon X7350 and Intel Xeon E3-1220L v3 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Xeon X7350
- 2 more cores, run more applications at once: 4 vs 2
- Around 53% better performance in PassMark - Single thread mark: 1186 vs 777
- 5.6x better performance in PassMark - CPU mark: 7836 vs 1407
| Specifications (specs) | |
| Number of cores | 4 vs 2 |
| Benchmarks | |
| PassMark - Single thread mark | 1186 vs 777 |
| PassMark - CPU mark | 7836 vs 1407 |
Reasons to consider the Intel Xeon E3-1220L v3
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- 524288x more L3 cache, more data can be stored in the L3 cache for quick access later
- 10x lower typical power consumption: 13 Watt vs 130 Watt
| Manufacturing process technology | 22 nm vs 65 nm |
| L3 cache | 4096 KB (shared) vs 8 MB L2 Cache |
| Thermal Design Power (TDP) | 13 Watt vs 130 Watt |
Compare benchmarks
CPU 1: Intel Xeon X7350
CPU 2: Intel Xeon E3-1220L v3
| PassMark - Single thread mark |
|
|
||||
| PassMark - CPU mark |
|
|
| Name | Intel Xeon X7350 | Intel Xeon E3-1220L v3 |
|---|---|---|
| PassMark - Single thread mark | 1186 | 777 |
| PassMark - CPU mark | 7836 | 1407 |
| Geekbench 4 - Single Core | 1745 | |
| Geekbench 4 - Multi-Core | 3086 |
Compare specifications (specs)
| Intel Xeon X7350 | Intel Xeon E3-1220L v3 | |
|---|---|---|
Essentials |
||
| Architecture codename | Tigerton | Haswell |
| Launch date | Q3'07 | June 2013 |
| Place in performance rating | 1878 | 1874 |
| Processor Number | X7350 | E3-1220LV3 |
| Series | Legacy Intel Xeon Processors | Intel® Xeon® Processor E3 v3 Family |
| Vertical segment | Server | Server |
| Status | Launched | |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.93 GHz | 1.10 GHz |
| Bus Speed | 1066 MHz | 5 GT/s DMI |
| Die size | 286 mm2 | 160 mm |
| L3 cache | 8 MB L2 Cache | 4096 KB (shared) |
| Manufacturing process technology | 65 nm | 22 nm |
| Maximum core temperature | 66°C | |
| Number of cores | 4 | 2 |
| Transistor count | 582 million | 1400 million |
| VID voltage range | 1.0000V-1.5000V | |
| L1 cache | 64 KB (per core) | |
| L2 cache | 256 KB (per core) | |
| Maximum frequency | 1.50 GHz | |
| Number of QPI Links | 0 | |
| Number of threads | 4 | |
Compatibility |
||
| Package Size | 53.3mm x 53.3mm | 37.5mm x 37.5mm |
| Sockets supported | PGA604, PPGA604 | FCLGA1150 |
| Thermal Design Power (TDP) | 130 Watt | 13 Watt |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Thermal Solution | PCG 2013A | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Anti-Theft technology | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® vPro™ Platform Eligibility | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 25.6 GB/s | |
| Maximum memory size | 32 GB | |
| Supported memory types | DDR3 1333/1600 | |
Graphics |
||
| Processor graphics | None | |
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | 1x16, 2x8, 1x8/2x4 | |
| Scalability | 1S Only | |
