Intel Xeon E3-1225 v6 vs Intel Xeon E3-1275 v3

Comparative analysis of Intel Xeon E3-1225 v6 and Intel Xeon E3-1275 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s).

Intel Xeon E3-1225 v6

Intel Xeon E3-1275 v3

Differences

Reasons to consider the Intel Xeon E3-1225 v6

A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
2x more maximum memory size: 64 GB vs 32 GB
Around 15% lower typical power consumption: 73 Watt vs 84 Watt

Specifications (specs)
Manufacturing process technology	14 nm vs 22 nm
Maximum memory size	64 GB vs 32 GB
Thermal Design Power (TDP)	73 Watt vs 84 Watt
Benchmarks
Geekbench 4 - Single Core	911 vs 909

Reasons to consider the Intel Xeon E3-1275 v3

4 more threads: 8 vs 4
Around 5% higher clock speed: 3.90 GHz vs 3.70 GHz
Around 10% better performance in PassMark - Single thread mark: 2225 vs 2014
Around 28% better performance in PassMark - CPU mark: 7275 vs 5670
Around 8% better performance in Geekbench 4 - Multi-Core: 3422 vs 3173

Specifications (specs)
Number of threads	8 vs 4
Maximum frequency	3.90 GHz vs 3.70 GHz
Benchmarks
PassMark - Single thread mark	2225 vs 2014
PassMark - CPU mark	7275 vs 5670
Geekbench 4 - Multi-Core	3422 vs 3173

Compare benchmarks

CPU 1: Intel Xeon E3-1225 v6
CPU 2: Intel Xeon E3-1275 v3

PassMark - Single thread mark

CPU 1

CPU 2

2014

2225

PassMark - CPU mark

CPU 1

CPU 2

5670

7275

Geekbench 4 - Single Core

CPU 1

CPU 2

911

909

Geekbench 4 - Multi-Core

CPU 1

CPU 2

3173

3422

Name	Intel Xeon E3-1225 v6	Intel Xeon E3-1275 v3
PassMark - Single thread mark	2014	2225
PassMark - CPU mark	5670	7275
Geekbench 4 - Single Core	911	909
Geekbench 4 - Multi-Core	3173	3422
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		16.134

Compare specifications (specs)

	Intel Xeon E3-1225 v6	Intel Xeon E3-1275 v3
Essentials
Architecture codename	Kaby Lake	Haswell
Launch date	Q1'17	June 2013
Place in performance rating	1493	1418
Processor Number	E3-1225V6	E3-1275 v3
Series	Intel® Xeon® Processor E3 v6 Family	Intel® Xeon® Processor E3 v3 Family
Status	Launched	Launched
Vertical segment	Server	Server
Launch price (MSRP)		$531
Price now		$400.99
Value for money (0-100)		7.26
Performance
64 bit support
Base frequency	3.30 GHz	3.50 GHz
Bus Speed	8 GT/s DMI3	5 GT/s DMI
Manufacturing process technology	14 nm	22 nm
Maximum frequency	3.70 GHz	3.90 GHz
Number of cores	4	4
Number of threads	4	8
VID voltage range	0.55V-1.52V
Die size		160 mm
L1 cache		64 KB (per core)
L2 cache		256 KB (per core)
L3 cache		8192 KB (shared)
Number of QPI Links		0
Transistor count		1400 million
Memory
Max memory channels	2	2
Maximum memory bandwidth	37.5 GB/s	25.6 GB/s
Maximum memory size	64 GB	32 GB
Supported memory types	DDR4-2400, DDR3L-1866	DDR3 and DDR3L 1333/1600 at 1.5V
ECC memory support
Graphics
Device ID	0x591D
Graphics base frequency	350 MHz	350 MHz
Graphics max dynamic frequency	1.15 GHz	1.25 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	64 GB
Processor graphics	Intel® HD Graphics P630	Intel HD Graphics P4600
Graphics max frequency		1.25 GHz
Intel® Flexible Display Interface (Intel® FDI)
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3	3
Graphics image quality
4K resolution support
Max resolution over DisplayPort	4096x2304@60Hz
Max resolution over eDP	4096x2304@60Hz
Max resolution over HDMI 1.4	4096x2160@24Hz
Graphics API support
DirectX	12
OpenGL	4.4
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	FCLGA1151	FCLGA1150
Thermal Design Power (TDP)	73 Watt	84 Watt
Thermal Solution		PCG 2013D
Peripherals
Max number of PCIe lanes	16	16
PCI Express revision	3.0	3.0
PCIe configurations	1x16, 2x8, 1x8+2x4	1x16, 2x8, 1x8/2x4
Scalability	1S Only	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Anti-Theft technology
Intel® Identity Protection technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Flexible Display interface (FDI)
Intel® Advanced Vector Extensions (AVX)
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Stable Image Platform Program (SIPP)
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)