Intel Xeon E3-1275 v3 vs Intel Xeon E5-2637

Comparative analysis of Intel Xeon E3-1275 v3 and Intel Xeon E5-2637 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s).

Intel Xeon E3-1275 v3

Intel Xeon E5-2637

Differences

Reasons to consider the Intel Xeon E3-1275 v3

CPU is newer: launch date 1 year(s) 3 month(s) later
2 more cores, run more applications at once: 4 vs 2
4 more threads: 8 vs 4
Around 11% higher clock speed: 3.90 GHz vs 3.50 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
2x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 60% more L3 cache; more data can be stored in the L3 cache for quick access later
Around 33% better performance in PassMark - Single thread mark: 2201 vs 1654
Around 25% better performance in PassMark - CPU mark: 7213 vs 5775

Specifications (specs)
Launch date	June 2013 vs March 2012
Number of cores	4 vs 2
Number of threads	8 vs 4
Maximum frequency	3.90 GHz vs 3.50 GHz
Manufacturing process technology	22 nm vs 32 nm
L1 cache	64 KB (per core) vs 64 KB (per core)
L2 cache	256 KB (per core) vs 256 KB (per core)
L3 cache	8192 KB (shared) vs 5120 KB (shared)
Benchmarks
PassMark - Single thread mark	2201 vs 1654
PassMark - CPU mark	7213 vs 5775

Reasons to consider the Intel Xeon E5-2637

12x more maximum memory size: 384 GB vs 32 GB
Around 5% lower typical power consumption: 80 Watt vs 84 Watt

Maximum memory size	384 GB vs 32 GB
Max number of CPUs in a configuration	2 vs 1
Thermal Design Power (TDP)	80 Watt vs 84 Watt

Compare benchmarks

CPU 1: Intel Xeon E3-1275 v3
CPU 2: Intel Xeon E5-2637

PassMark - Single thread mark

CPU 1

CPU 2

2201

1654

PassMark - CPU mark

CPU 1

CPU 2

7213

5775

Name	Intel Xeon E3-1275 v3	Intel Xeon E5-2637
PassMark - Single thread mark	2201	1654
PassMark - CPU mark	7213	5775
Geekbench 4 - Single Core	909
Geekbench 4 - Multi-Core	3422
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	16.134

Compare specifications (specs)

	Intel Xeon E3-1275 v3	Intel Xeon E5-2637
Essentials
Architecture codename	Haswell	Sandy Bridge EP
Launch date	June 2013	March 2012
Launch price (MSRP)	$531
Place in performance rating	1510	1496
Price now	$400.99
Processor Number	E3-1275 v3	E5-2637
Series	Intel® Xeon® Processor E3 v3 Family	Intel® Xeon® Processor E5 Family
Status	Launched	Discontinued
Value for money (0-100)	7.26
Vertical segment	Server	Server
Performance
64 bit support
Base frequency	3.50 GHz	3.00 GHz
Bus Speed	5 GT/s DMI	8 GT/s QPI
Die size	160 mm	294 mm
L1 cache	64 KB (per core)	64 KB (per core)
L2 cache	256 KB (per core)	256 KB (per core)
L3 cache	8192 KB (shared)	5120 KB (shared)
Manufacturing process technology	22 nm	32 nm
Maximum frequency	3.90 GHz	3.50 GHz
Number of cores	4	2
Number of QPI Links	0	2
Number of threads	8	4
Transistor count	1400 million	1270 million
Maximum core temperature		70.0°C
VID voltage range		0.6V - 1.35V
Memory
ECC memory support
Max memory channels	2	4
Maximum memory bandwidth	25.6 GB/s	51.2 GB/s
Maximum memory size	32 GB	384 GB
Supported memory types	DDR3 and DDR3L 1333/1600 at 1.5V	DDR3 800/1066/1333/1600
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.25 GHz
Graphics max frequency	1.25 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics P4600
Graphics interfaces
Number of displays supported	3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	2
Package Size	37.5mm x 37.5mm	52.5mm x 45.0mm
Sockets supported	FCLGA1150	FCLGA2011
Thermal Design Power (TDP)	84 Watt	80 Watt
Thermal Solution	PCG 2013D
Peripherals
Max number of PCIe lanes	16	40
PCI Express revision	3.0	3.0
PCIe configurations	1x16, 2x8, 1x8/2x4
Scalability	1S Only	2S Only
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Intel® Demand Based Switching
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)