Intel Xeon E3-1275 v3 vs Intel Xeon E7-8870

Comparative analysis of Intel Xeon E3-1275 v3 and Intel Xeon E7-8870 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s).

Intel Xeon E3-1275 v3

Intel Xeon E7-8870

Differences

Reasons to consider the Intel Xeon E3-1275 v3

CPU is newer: launch date 2 year(s) 2 month(s) later
Around 39% higher clock speed: 3.90 GHz vs 2.80 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
Around 55% lower typical power consumption: 84 Watt vs 130 Watt
Around 98% better performance in PassMark - Single thread mark: 2201 vs 1110

Specifications (specs)
Launch date	June 2013 vs April 2011
Maximum frequency	3.90 GHz vs 2.80 GHz
Manufacturing process technology	22 nm vs 32 nm
Thermal Design Power (TDP)	84 Watt vs 130 Watt
Benchmarks
PassMark - Single thread mark	2201 vs 1110

Reasons to consider the Intel Xeon E7-8870

6 more cores, run more applications at once: 10 vs 4
12 more threads: 20 vs 8
2.5x more L1 cache, more data can be stored in the L1 cache for quick access later
2.5x more L2 cache, more data can be stored in the L2 cache for quick access later
3.8x more L3 cache, more data can be stored in the L3 cache for quick access later
128x more maximum memory size: 4 TB vs 32 GB
3.6x better performance in PassMark - CPU mark: 25895 vs 7195

Specifications (specs)
Number of cores	10 vs 4
Number of threads	20 vs 8
L1 cache	64 KB (per core) vs 64 KB (per core)
L2 cache	256 KB (per core) vs 256 KB (per core)
L3 cache	30720 KB (shared) vs 8192 KB (shared)
Maximum memory size	4 TB vs 32 GB
Max number of CPUs in a configuration	8 vs 1
Benchmarks
PassMark - CPU mark	25895 vs 7195

Compare benchmarks

CPU 1: Intel Xeon E3-1275 v3
CPU 2: Intel Xeon E7-8870

PassMark - Single thread mark

CPU 1

CPU 2

2201

1110

PassMark - CPU mark

CPU 1

CPU 2

7195

25895

Name	Intel Xeon E3-1275 v3	Intel Xeon E7-8870
PassMark - Single thread mark	2201	1110
PassMark - CPU mark	7195	25895
Geekbench 4 - Single Core	909
Geekbench 4 - Multi-Core	3422
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	16.134

Compare specifications (specs)

	Intel Xeon E3-1275 v3	Intel Xeon E7-8870
Essentials
Architecture codename	Haswell	Westmere EX
Launch date	June 2013	April 2011
Launch price (MSRP)	$531
Place in performance rating	1517	1519
Price now	$400.99
Processor Number	E3-1275 v3	E7-8870
Series	Intel® Xeon® Processor E3 v3 Family	Intel® Xeon® Processor E7 Family
Status	Launched	Discontinued
Value for money (0-100)	7.26
Vertical segment	Server	Server
Performance
64 bit support
Base frequency	3.50 GHz	2.40 GHz
Bus Speed	5 GT/s DMI	6.4 GT/s QPI
Die size	160 mm	513 mm
L1 cache	64 KB (per core)	64 KB (per core)
L2 cache	256 KB (per core)	256 KB (per core)
L3 cache	8192 KB (shared)	30720 KB (shared)
Manufacturing process technology	22 nm	32 nm
Maximum frequency	3.90 GHz	2.80 GHz
Number of cores	4	10
Number of QPI Links	0
Number of threads	8	20
Transistor count	1400 million	2600 million
Maximum core temperature		69°C
Memory
ECC memory support
Max memory channels	2	4
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	32 GB	4 TB
Supported memory types	DDR3 and DDR3L 1333/1600 at 1.5V	DDR3 800/978/1066/1333 (Max Speed 1066 MHz)
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.25 GHz
Graphics max frequency	1.25 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics P4600
Graphics interfaces
Number of displays supported	3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	8
Package Size	37.5mm x 37.5mm	49.17mm x 56.47mm
Sockets supported	FCLGA1150	LGA1567
Thermal Design Power (TDP)	84 Watt	130 Watt
Thermal Solution	PCG 2013D
Peripherals
Max number of PCIe lanes	16
PCI Express revision	3.0
PCIe configurations	1x16, 2x8, 1x8/2x4
Scalability	1S Only	S8S
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)